Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11276634 | High density package substrate formed with dielectric bi-layer | Srinivas V. Pietambaram, Rahul N. Manepalli, Frank Truong, Kyu Oh Lee, Junnan Zhao +1 more | 2022-03-15 |
| 11127682 | Semiconductor package having nonspherical filler particles | Sashi S. Kandanur, Srinivas V. Pietambaram | 2021-09-21 |
| 10998282 | Surface finishes for high density interconnect architectures | Srinivas V. Pietambaram | 2021-05-04 |
| 10438914 | Surface finishes for high density interconnect architectures | Srinivas V. Pietambaram | 2019-10-08 |
| 10049996 | Surface finishes for high density interconnect architectures | Srinivas V. Pietambaram | 2018-08-14 |