Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Low temperature solder in a photonic device

Low temperature solder in a photonic device

US Patent 11181689 · Granted Nov 23, 2021

Estimated economic value: $70,969,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Optical wafer-level package2025
Optical packaging features for mechanical stability and optical fiber coupling2025
Opto-electrical flexible glass interposer2024
Optical modulator using monocrystalline and polycrystalline silicon2024
Electro-optical modulator using waveguides with overlapping ridges2024
Socket locator2023
Integrated decoupling capacitors2023
Integrated circuit bridge for photonics and electrical chip integration2023
Photonics packaging platform2023
Photonics packaging platform2023
Photonics packaging platform2023
Evanescent coupling of photodiode with optical waveguide2023