Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9374902 | Package including an underfill material in a portion of an area between the package and a substrate or another package | Myung Jin Yim, Nanette Quevedo | 2016-06-21 |
| 8451620 | Package including an underfill material in a portion of an area between the package and a substrate or another package | Myung Jin Yim, Nanette Quevedo | 2013-05-28 |