Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12322721 | Asymmetric Stackup Structure for SoC package substrates | Yikang Deng, Taegui Kim, Jun Chung Hsu | 2025-06-03 |
| 11908819 | Semiconductor packaging substrate fine pitch metal bump and reinforcement structures | Jun Chung Hsu, Chih-Ming Chung, Jun Zhai, Young Doo Jeon, Taegui Kim | 2024-02-20 |
| 11862597 | Asymmetric stackup structure for SoC package substrates | Yikang Deng, Taegui Kim, Jun Chung Hsu | 2024-01-02 |
| 11545455 | Semiconductor packaging substrate fine pitch metal bump and reinforcement structures | Jun Chung Hsu, Chih-Ming Chung, Jun Zhai, Young Doo Jeon, Taegui Kim | 2023-01-03 |