Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7524763 | Fabrication method of wafer level chip scale packages | Soon-Bum Kim, Keum-Hee Ma, Young-Hee Song, Sung-Min Sim, Se-Yong Oh +2 more | 2009-04-28 |
| 7151009 | Method for manufacturing wafer level chip stack package | Soon-Bum Kim, Kang-Wook Lee, Se-Young Jeong, Young-Hee Song, Sung-Min Sim | 2006-12-19 |