Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8362621 | Microelectronic devices including multiple through-silicon via structures on a conductive pad and methods of fabricating the same | Ho-Jin Lee, Dong-Hyeon Jang, Nam-Seog Kim, In-Young Lee | 2013-01-29 |
| 8129840 | Semiconductor package and methods of manufacturing the same | Chajea Jo, Uihyoung Lee, Jae-hyun Phee, Jeong Woo Park | 2012-03-06 |