Issued Patents All Time
Showing 26–45 of 45 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7545027 | Wafer level package having redistribution interconnection layer and method of forming the same | Hyun-Soo Chung, In-Young Lee, Myeong-Soon Park, Dong-Ho Lee | 2009-06-09 |
| 7537959 | Chip stack package and manufacturing method thereof | Kang-Wook Lee, Gu-Sung Kim, Seung-Duk Baek, Jae-Sik Chung | 2009-05-26 |
| 7534656 | Image sensor device and method of manufacturing the same | Yong-Chai Kwon, Kang-Wook Lee, Gu-Sung Kim, Seong-Il Han, Keum-Hee Ma +1 more | 2009-05-19 |
| 7312143 | Wafer level chip scale package having a gap and method for manufacturing the same | Myeong-Soon Park, Hyun-Soo Chung, In-Young Lee, Jae-Sik Chung, Sung-Min Sim +2 more | 2007-12-25 |
| 7307340 | Wafer-level electronic modules with integral connector contacts | Seung-Duk Baek, Gu-Sung Kim, Kang-Wook Lee, Jae-Sik Chung | 2007-12-11 |
| 7300864 | Method for forming solder bump structure | Keum-Hee Ma, Se-Young Jeong, Gu-Sung Kim | 2007-11-27 |
| 7276799 | Chip stack package and manufacturing method thereof | Kang-Wook Lee, Gu-Sung Kim, Seung-Duk Baek, Jae-Sik Chung | 2007-10-02 |
| 7274097 | Semiconductor package including redistribution pattern and method of manufacturing the same | Seung-Duk Baek, Jong-Joo Lee | 2007-09-25 |
| 7262475 | Image sensor device and method of manufacturing same | Yong-Chai Kwon, Kang-Wook Lee, Gu-Sung Kim, Seong-Il Han, Keum-Hee Ma +1 more | 2007-08-28 |
| 7224055 | Center pad type IC chip with jumpers, method of processing the same and multi chip package | Gu-Sung Kim | 2007-05-29 |
| 7205660 | Wafer level chip scale package having a gap and method for manufacturing the same | Myeong-Soon Park, Hyun-Soo Chung, In-Young Lee, Jae-Sik Chung, Sung-Min Sim +2 more | 2007-04-17 |
| 7196000 | Method for manufacturing a wafer level chip scale package | Jin Hyuk Lee, Gu-Sung Kim, Dong-Ho Lee | 2007-03-27 |
| 6903451 | Chip scale packages manufactured at wafer level | Nam-Seog Kim, Sa-Yoon Kang, Heung-Kyu Kwon | 2005-06-07 |
| 6836018 | Wafer level package and method for manufacturing the same | Gu-Sung Kim, Min Young Son, Sa-Yoon Kang | 2004-12-28 |
| 6607938 | Wafer level stack chip package and method for manufacturing same | Yong-Hwan Kwon, Sa-Yoon Kang, Min Kyo Cho, Gu-Sung Kim | 2003-08-19 |
| 6586275 | Wafer level package and method for manufacturing the same | Gu-Sung Kim, Min Young Son, Sa-Yoon Kang | 2003-07-01 |
| 6555921 | Semiconductor package | Yong-Hwan Kwon, Sa-Yoon Kang, Nam-Seog Kim | 2003-04-29 |
| 6518675 | Wafer level package and method for manufacturing the same | Gu-Sung Kim, Min Young Son, Sa-Yoon Kang | 2003-02-11 |
| 6376279 | method for manufacturing a semiconductor package | Yong-Hwan Kwon, Sa-Yoon Kang, Nam-Seog Kim | 2002-04-23 |
| 6187615 | Chip scale packages and methods for manufacturing the chip scale packages at wafer level | Nam-Seog Kim, Sa-Yoon Kang, Heung-Kyu Kwon | 2001-02-13 |