Issued Patents All Time
Showing 25 most recent of 50 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12347509 | Memory system including a sub-controller and operating method of the sub-controller | — | 2025-07-01 |
| 12087390 | Storage device based on daisy chain topology | Jeffrey Kwak, Jae Hoon Ko, Kyung-Woo Kim, Hee Ju KIM | 2024-09-10 |
| 11901027 | Memory system including a sub-controller and operating method of the sub-controller | — | 2024-02-13 |
| 11569109 | Wafer cassette stocker and wafer cassette drying method using the same | Dae Won Kim | 2023-01-31 |
| 10971486 | Semiconductor package and method of manufacturing the semiconductor package | Hee-Won Kang | 2021-04-06 |
| 10461033 | Semiconductor memory package | Hee Woo AN | 2019-10-29 |
| 10381334 | Semiconductor package and method of manufacturing the semiconductor package | Hee-Won Kang | 2019-08-13 |
| 10128191 | Package-on-package type package including integrated circuit devices and associated passive components on different levels | — | 2018-11-13 |
| RE46666 | Package board having internal terminal interconnection and semiconductor package employing the same | — | 2018-01-09 |
| 9679853 | Package-on-package type package including integrated circuit devices and associated passive components on different levels | — | 2017-06-13 |
| 9400950 | Integrated circuit card socket having a terminal with a loop-shaped portion | Seok-Jae Han | 2016-07-26 |
| 9391048 | Semiconductor package | — | 2016-07-12 |
| 9165893 | Semiconductor device including coupling conductive pattern | Yong Hoon Kim, Sang Youb Lee, Young-Don Choi, Hee-Seok Lee | 2015-10-20 |
| 8884421 | Multi-chip package and method of manufacturing the same | Un-Byoung Kang, Yong Hoon Kim, Tae Hong Min | 2014-11-11 |
| 8853854 | Semiconductor package and method of manufacturing the same | — | 2014-10-07 |
| 8796847 | Package substrate having main dummy pattern located in path of stress | — | 2014-08-05 |
| 8723315 | Flip chip package | Tae-Joo Hwang, Cha-Jea Jo | 2014-05-13 |
| 8643178 | Semiconductor chips having redistributed power/ground lines directly connected to power/ground lines of internal circuits and methods of fabricating the same | — | 2014-02-04 |
| 8633579 | Multi-chip package and method of manufacturing the same | Un-Byoung Kang, Yong Hoon Kim, Tae Hong Min | 2014-01-21 |
| 8625938 | Electronic device having optical communicating part | — | 2014-01-07 |
| 8604616 | Semiconductor chip including a chip via plug penetrating a substrate, a semiconductor stack, a semiconductor device package and an electronic apparatus including the semiconductor chip | — | 2013-12-10 |
| 8471362 | Three-dimensional stacked structure semiconductor device having through-silicon via and signaling method for the semiconductor device | — | 2013-06-25 |
| 8446016 | Chip stack package | Sun-Won Kang, Seung-Duk Baek | 2013-05-21 |
| 8410611 | Semiconductor chips having redistributed power/ground lines directly connected to power/ground lines of internal circuits and methods of fabricating the same | — | 2013-04-02 |
| 8319324 | High I/O semiconductor chip package and method of manufacturing the same | — | 2012-11-27 |