Issued Patents All Time
Showing 26–50 of 50 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8319351 | Planar multi semiconductor chip package | — | 2012-11-27 |
| 8309372 | Method of manufacturing stacked semiconductor package | — | 2012-11-13 |
| 8178969 | Flip chip package | Tae-Joo Hwang, Cha-Jea Jo | 2012-05-15 |
| 8125068 | Semiconductor chip including a chip via plug penetrating a substrate, a semiconductor stack, a semiconductor device package and an electronic apparatus including the semiconductor chip | — | 2012-02-28 |
| 8120176 | Semiconductor device having a conductive bump | Dong-Kil Shin, Shle-Ge Lee, Jong Ho Lee | 2012-02-21 |
| 8115315 | Semiconductor chips having redistributed power/ground lines directly connected to power/ground lines of internal circuits and methods of fabricating the same | — | 2012-02-14 |
| 8097940 | Stack package | Seung-Duk Baek, Sun-Won Kang | 2012-01-17 |
| 8061024 | Method of fabricating a circuit board and semiconductor package. | Soon-Yong Hur | 2011-11-22 |
| 8044302 | Printed circuit board having coplanar LC balance | — | 2011-10-25 |
| 8039928 | Chip stack package | Sun-Won Kang, Seung-Duk Baek | 2011-10-18 |
| 8004081 | Semiconductor chip package and printed circuit board having through interconnections | Seung-Duk Baek | 2011-08-23 |
| 7964948 | Chip stack, chip stack package, and method of forming chip stack and chip stack package | Sun-Won Kang | 2011-06-21 |
| 7821127 | Semiconductor device package having buffered memory module and method thereof | Young-Hee Song | 2010-10-26 |
| 7768115 | Stack chip and stack chip package having the same | Dong-Ho Lee | 2010-08-03 |
| 7745922 | Package board having internal terminal interconnection and semiconductor package employing the same | — | 2010-06-29 |
| 7675181 | Planar multi semiconductor chip package and method of manufacturing the same | — | 2010-03-09 |
| 7652383 | Semiconductor package module without a solder ball and method of manufacturing the semiconductor package module | Seung-Duk Baek, Sun-Won Kang, Dong-Ho Lee, Sang Wook Park | 2010-01-26 |
| 7586182 | Packaged semiconductor die and manufacturing method thereof | Seung-Duk Baek, Sun-Won Kang, Sang Wook Park, Dong-Ho Lee | 2009-09-08 |
| 7545037 | Semiconductor chips having redistributed power/ground lines directly connected to power/ground lines of internal circuits and methods of fabricating the same | — | 2009-06-09 |
| 7462930 | Stack chip and stack chip package having the same | Dong-Ho Lee | 2008-12-09 |
| 7394160 | Printed wires arrangement for in-line memory (IMM) module | Moon Jung Kim | 2008-07-01 |
| 7317247 | Semiconductor package having heat spreader and package stack using the same | Young-Hee Song | 2008-01-08 |
| 7274097 | Semiconductor package including redistribution pattern and method of manufacturing the same | Seung-Duk Baek, Dong-Hyeon Jang | 2007-09-25 |
| 7131847 | Test apparatus having intermediate connection board for package | — | 2006-11-07 |
| 7064444 | Multi-chip ball grid array package | Dong-Ho Lee | 2006-06-20 |