Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11776866 | Semiconductor module heatspreading lid having integrated separators for multiple chips | Youngbae Kim, Ae-Nee Jang | 2023-10-03 |
| 11527470 | Film package and method of fabricating package module | Youngbae Kim, Ji-Yong Park | 2022-12-13 |
| 11140772 | Printed circuit board including warpage offset regions and semiconductor packages including the same | Youngbae Kim | 2021-10-05 |
| 11024568 | Semiconductor package | Young Bae Kim | 2021-06-01 |
| 10672694 | Printed circuit board, semiconductor package including the printed circuit board, and method of manufacturing the printed circuit board | Dong Suk Kim, Kyong-Soon Cho, Yu-duk Kim | 2020-06-02 |
| 10506706 | Printed circuit board including warpage offset regions and semiconductor packages including the same | Youngbae Kim | 2019-12-10 |
| 9728497 | Semiconductor device and method of manufacturing the same | Yu-duk Kim, Kyong-Soon Cho, Da Hee PARK | 2017-08-08 |
| 8427841 | Electronic device | Dong-Kil Shin | 2013-04-23 |
| 8120176 | Semiconductor device having a conductive bump | Dong-Kil Shin, Jong-Joo Lee, Jong Ho Lee | 2012-02-21 |