Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867857 | Method of cutting substrate and method of singulating semiconductor chips | Chang-Seong Jeon, Seung-Hun Shin, Teak-Hoon Lee | 2020-12-15 |
| 10510724 | Semiconductor device package | Jin-Woo Park | 2019-12-17 |