Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12362328 | Semiconductor package and method of fabricating the same | Jaekyung Yoo, Jae Eun Lee, Yeongkwon Ko, Jin-Woo Park, Teak-Hoon Lee | 2025-07-15 |
| 11923343 | Semiconductor package and method of fabricating the same | Jaekyung Yoo, Jae Eun Lee, Yeongkwon Ko, Jin-Woo Park, Teak-Hoon Lee | 2024-03-05 |
| 11791282 | Semiconductor package including part of underfill on portion of a molding material surrounding sides of logic chip and memory stack on interposer and method for manufacturing the same | Jaekyung Yoo, Yeongkwon Ko, Jaeeun Lee, Teakhoon Lee | 2023-10-17 |
| 11538792 | Semiconductor package and method of fabricating the same | Jaekyung Yoo, Jae Eun Lee, Yeongkwon Ko, Jin-Woo Park, Teak-Hoon Lee | 2022-12-27 |