Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406888 | Semiconductor substrate and method of dicing the same | Donghoon Won, Jaeeun Lee, Yeongkwon Ko | 2025-09-02 |
| 12355004 | Semiconductor chip and semiconductor package | Yeongkwon Ko, Unbyoung Kang, Teakhoon Lee | 2025-07-08 |
| 12094794 | Semiconductor package and method of fabricating the same | Yeongkwon Ko, Seunghun Shin | 2024-09-17 |
| 11996367 | Semiconductor device and semiconductor package including the same | Yeongkwon Ko, Jaeeun Lee | 2024-05-28 |
| 11935832 | Semiconductor device and method of fabricating the same | Unbyoung Kang, Donghoon Won | 2024-03-19 |
| 11869821 | Semiconductor package having molding layer with inclined side wall | Yeongkwon Ko, Seunghun Shin | 2024-01-09 |
| 11721669 | Semiconductor package including a first semiconductor stack and a second semiconductor stack of different widths | Jae Eun Lee, Yeongkwon Ko, Donghoon Won | 2023-08-08 |
| 11694963 | Semiconductor device and semiconductor package including the same | Yeongkwon Ko, Jaeeun Lee | 2023-07-04 |
| 11515226 | Semiconductor package and method of fabricating the same | Yeongkwon Ko, Seunghun Shin | 2022-11-29 |
| 11469180 | Semiconductor device including an insulating material layer with concave-convex portions | Unbyoung Kang, Donghoon Won | 2022-10-11 |
| 11424172 | Semiconductor package | Yeongkwon Ko, Seunghun Shin | 2022-08-23 |
| 11239171 | Semiconductor device and semiconductor package including the same | Yeongkwon Ko, Jaeeun Lee | 2022-02-01 |
| 9875992 | Semiconductor package having stacked chips and a heat dissipation part and method of fabricating the same | Chajea Jo, Taeje Cho | 2018-01-23 |