Issued Patents All Time
Showing 25 most recent of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12394641 | Molding apparatus of semiconductor package | Jinwoo Park, Myungsung Kang, Jaekyung Yoo, Unbyoung Kang | 2025-08-19 |
| 12381151 | Semiconductor device and semiconductor package including the same | Ju-Il Choi, Gyuho Kang, Seong-Hoon Bae, Dongjoon Oh, Hyunsu Hwang | 2025-08-05 |
| 12368093 | Semiconductor packages | Ju-Il Choi, Jumyong Park, Jin Ho An, Dongjoon Oh, Jeonggi Jin +1 more | 2025-07-22 |
| 12224256 | Wafer structure and semiconductor device | Hyunsu Hwang, Junyun Kweon, Jumyong Park, Solji Song, Dongjoon Oh | 2025-02-11 |
| 12218102 | Semiconductor package | Youngkun JEE, Unbyoung Kang, Sanghoon Lee | 2025-02-04 |
| 12199056 | Semiconductor device, semiconductor package and method of manufacturing the same | Jumyong Park, Unbyoung Kang, Byeongchan KIM, Solji Song | 2025-01-14 |
| 12094847 | Semiconductor package and method of manufacturing the same | Seyeong SEOK, Un-Byoung Kang | 2024-09-17 |
| 12021034 | Semiconductor package and method of manufacturing the semiconductor package | Solji Song, Byeongchan KIM, Jumyong Park, Jinho An, Jeonggi Jin +1 more | 2024-06-25 |
| 12014977 | Interconnection structure, method of fabricating the same, and semiconductor package including interconnection structure | Ji-Seok Hong, Dongwoo Kim, Hyunah KIM, Un-Byoung Kang | 2024-06-18 |
| 12009288 | Interconnection structure and semiconductor package including the same | Dongjoon Oh, Junyun Kweon, Jumyong Park, Jin Ho An, Hyunsu Hwang | 2024-06-11 |
| 11996358 | Semiconductor packages having first and second redistribution patterns | Ju-Il Choi, Jumyong Park, Jin Ho An, Dongjoon Oh, Jeonggi Jin +1 more | 2024-05-28 |
| 11923309 | Semiconductor package including fine redistribution patterns | Hyunsu Hwang, Junyun Kweon, Jumyong Park, Jin Ho An, Dongjoon Oh +1 more | 2024-03-05 |
| 11854893 | Method of manufacturing semiconductor package | Junyun Kweon, Jumyong Park, Solji Song, Dongjoon Oh, Hyunsu Hwang | 2023-12-26 |
| 11824076 | Semiconductor package including an image sensor chip and a method of fabricating the same | Yonghoe Cho, Yoonha Jung, Chajea Jo | 2023-11-21 |
| 11705323 | Wafer trimming device | Jungseok Ahn, Unbyoung Kang, Teakhoon Lee | 2023-07-18 |
| 11688679 | Interconnection structure, method of fabricating the same, and semiconductor package including interconnection structure | Ji-Seok Hong, Dongwoo Kim, Hyunah KIM, Un-Byoung Kang | 2023-06-27 |
| 11664312 | Semiconductor device and semiconductor package including the same | Ju-Il Choi, Gyuho Kang, Seong-Hoon Bae, Dongjoon Oh, Hyunsu Hwang | 2023-05-30 |
| 11637058 | Interconnection structure and semiconductor package including the same | Ju-Il Choi, Jumyong Park, Jin Ho An, Teahwa Jeong, Jeonggi Jin | 2023-04-25 |
| 11335719 | Semiconductor package including an image sensor chip and a method of fabricating the same | Yonghoe Cho, Yoonha Jung, Chajea Jo | 2022-05-17 |
| 10157766 | Method of fabricating a semiconductor device | Un-Byoung Kang, Joonsik Sohn, Jung-Seok Ahn, Taeje Cho | 2018-12-18 |
| 9595446 | Methods of processing substrates | Jung-Hwan Kim, Kwang-chul Choi, Un-Byoung Kang, Jeon Il Lee | 2017-03-14 |
| 9412636 | Methods for processing substrates | Jung-Seok Ahn, Kwang-chul Choi, Un-Byoung Kang, Jung-Hwan Kim, Joonsik Sohn +1 more | 2016-08-09 |
| 9059072 | Semiconductor packages and methods of fabricating the same | Eun-Kyoung Choi, SeYoung Jeong, Kwang-chul Choi, Tae Hong Min, Jung-Hwan Kim | 2015-06-16 |
| 9023716 | Methods for processing substrates | Jung-Seok Ahn, Kwang-chul Choi, Un-Byoung Kang, Jung-Hwan Kim, Joonsik Sohn +1 more | 2015-05-05 |
| 9006081 | Methods of processing substrates | Jung-Seok Ahn, Il Hwan Kim, Jung-Hwan Kim, Sangwook Park, Kwang-chul Choi | 2015-04-14 |