Issued Patents All Time
Showing 1–25 of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12328869 | Semiconductor memory devices and methods for fabricating the same | Ji Hoon CHANG, Jung-Hoon Han, Dong-Sik Park | 2025-06-10 |
| 12040313 | Semiconductor package and a method for manufacturing the same | Hyuekjae Lee, Jihoon Kim, Jihwan Suh, So Youn Lee, Jihwan Hwang +1 more | 2024-07-16 |
| 12014977 | Interconnection structure, method of fabricating the same, and semiconductor package including interconnection structure | Dongwoo Kim, Hyunah KIM, Un-Byoung Kang, Chungsun Lee | 2024-06-18 |
| 11984425 | Semiconductor package | Jin-Woo Park | 2024-05-14 |
| 11887900 | Semiconductor package including test pad | Hyuek Jae Lee, Tae Hun Kim, Ji Hwan Hwang, Ji Hoon Kim | 2024-01-30 |
| 11887968 | Method of manufacturing a semiconductor package | Ji Hwan Hwang, Ji Hoon Kim, Tae Hun Kim, Hyuek Jae Lee | 2024-01-30 |
| 11824006 | Semiconductor package | Byoung-Soo Kwak | 2023-11-21 |
| 11688679 | Interconnection structure, method of fabricating the same, and semiconductor package including interconnection structure | Dongwoo Kim, Hyunah KIM, Un-Byoung Kang, Chungsun Lee | 2023-06-27 |
| 11658148 | Semiconductor package and a method for manufacturing the same | Hyuekjae Lee, Jihoon Kim, Jihwan Suh, So Youn Lee, Jihwan Hwang +1 more | 2023-05-23 |
| 11581257 | Semiconductor package | Hyuek Jae Lee, Ji Hoon Kim, Tae Hun Kim, Ji Hwan Hwang | 2023-02-14 |
| 11329024 | Semiconductor package | Jin-Woo Park | 2022-05-10 |
| 11145626 | Semiconductor package | Ji Hwan Hwang, Ji Hoon Kim, Tae Hun Kim, Hyuek Jae Lee | 2021-10-12 |
| 11088038 | Semiconductor package including test pad | Hyuek Jae Lee, Tae Hun Kim, Ji Hwan Hwang, Ji Hoon Kim | 2021-08-10 |
| 11056432 | Semiconductor package | Hyuek Jae Lee, Ji Hoon Kim, Tae Hun Kim, Ji Hwan Hwang | 2021-07-06 |
| 10910346 | Semiconductor package | Ji Hoon Kim | 2021-02-02 |
| 10886255 | Die stack structure, semiconductor package having the same and method of manufacturing the same | Ji Hoon Kim, Tae Hun Kim, Hyuek Jae Lee, Ji Hwan Hwang | 2021-01-05 |
| 10790264 | Semiconductor package | Jin-Woo Park | 2020-09-29 |
| 9159659 | Semiconductor package and method of manufacturing the semiconductor package | Sang Won Kim, Kwang-chul Choi, Hyun-Jung Song, Cha-Jea Jo, Eun-Kyoung Choi | 2015-10-13 |
| 9054228 | Semiconductor packages including a heat spreader and methods of forming the same | Eun-Kyoung Choi, Jong Youn Kim, Sang Wook Park, Hae-Jung Yu, In-Young Lee +1 more | 2015-06-09 |
| 8958011 | Bi-directional camera module and flip chip bonder including the same | Sang-Sick Park, Myung-Sung Kang | 2015-02-17 |
| 8940557 | Method of fabricating wafer level package | Sang Won Kim, Jong Youn Kim, Eun-Kyoung Choi, Sang-Uk Han | 2015-01-27 |
| 8901727 | Semiconductor packages, methods of manufacturing semiconductor packages, and systems including semiconductor packages | Myun-sung Kang, Jung Ko, Sang-Sick Park, Won Keun Kim | 2014-12-02 |
| 8816509 | Semiconductor package including underfill layers | Kwang-chul Choi, Sangwon Kim, Hyun-Jung Song, Eun-Kyoung Choi | 2014-08-26 |
| 8664762 | Semiconductor package, electrical and electronic apparatus including the semiconductor package, and method of manufacturing the semiconductor package | Jong Gi LEE, Sang Wook Park | 2014-03-04 |
| 8552546 | Semiconductor package, semiconductor package structure including the semiconductor package, and mobile phone including the semiconductor package structure | In-sang Song, Seok-Keun Lim, In-Wook Jung, Bong-Ken Yu, Sang Wook Park | 2013-10-08 |