Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8552546 | Semiconductor package, semiconductor package structure including the semiconductor package, and mobile phone including the semiconductor package structure | In-sang Song, Seok-Keun Lim, Bong-Ken Yu, Sang Wook Park, Ji-Seok Hong | 2013-10-08 |