Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12354987 | Semiconductor device | Jeonggi Jin, Taehwa Jeong, Jinho Chun, Juil Choi, Atsushi Fujisaki | 2025-07-08 |
| 12224256 | Wafer structure and semiconductor device | Hyunsu Hwang, Junyun Kweon, Jumyong Park, Dongjoon Oh, Chungsun Lee | 2025-02-11 |
| 12218039 | Semiconductor package | Jeonggi Jin, Gyuho Kang, Un-Byoung Kang, Ju-Il Choi | 2025-02-04 |
| 12199056 | Semiconductor device, semiconductor package and method of manufacturing the same | Jumyong Park, Unbyoung Kang, Byeongchan KIM, Chungsun Lee | 2025-01-14 |
| 12021034 | Semiconductor package and method of manufacturing the semiconductor package | Byeongchan KIM, Jumyong Park, Jinho An, Chungsun Lee, Jeonggi Jin +1 more | 2024-06-25 |
| 11984420 | Semiconductor device | Jeonggi Jin, Taehwa Jeong, Jinho Chun, Juil Choi, Atsushi Fujisaki | 2024-05-14 |
| 11978688 | Semiconductor device having via protective layer | Jumyong Park, Jinho An, Jeonggi Jin, Jinho Chun, Juil Choi | 2024-05-07 |
| 11854893 | Method of manufacturing semiconductor package | Junyun Kweon, Jumyong Park, Dongjoon Oh, Chungsun Lee, Hyunsu Hwang | 2023-12-26 |
| 11676887 | Semiconductor package | Jeonggi Jin, Gyuho Kang, Un-Byoung Kang, Ju-Il Choi | 2023-06-13 |
| 11538783 | Semiconductor device | Jeonggi Jin, Taehwa Jeong, Jinho Chun, Juil Choi, Atsushi Fujisaki | 2022-12-27 |
| 11476176 | Semiconductor device having via protective layer | Jumyong Park, Jinho An, Jeonggi Jin, Jinho Chun, Juil Choi | 2022-10-18 |