Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9793165 | Methods of fabricating semiconductor devices | Taeje Cho, Hogeon Song, Kyu-Ha Lee | 2017-10-17 |
| 9153489 | Microelectronic devices having conductive through via electrodes insulated by gap regions | Ho-Jin Lee, Byung-Lyul Park, Hyunsoo Chung, Gilheyun Choi | 2015-10-06 |
| 9059072 | Semiconductor packages and methods of fabricating the same | Eun-Kyoung Choi, Kwang-chul Choi, Tae Hong Min, Chungsun Lee, Jung-Hwan Kim | 2015-06-16 |
| 8933561 | Semiconductor device for semiconductor package having through silicon vias of different heights | Hogeon Song, Chungsun Lee, Ho-Jin Lee | 2015-01-13 |
| 8766455 | Stacked semiconductor devices and fabrication methods thereof | Sunpil Youn, Hogeon Song | 2014-07-01 |
| 8759147 | Semiconductor packages and methods of fabricating the same | Eun-Kyoung Choi, Kwang-chul Choi, Tae Hong Min, Chungsun Lee, Jung-Hwan Kim | 2014-06-24 |
| 8492902 | Multi-layer TSV insulation and methods of fabricating the same | Ho-Jin Lee, Jae-hyun Phee, Jung-Hwan Kim, Tae Hong Min | 2013-07-23 |