Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12255076 | Method for manufacturing leadless semiconductor package with wettable flanks | Aaron Cadag, Ela Mia Cadag | 2025-03-18 |
| 12224251 | Semiconductor device having cavities at an interface of an encapsulant and a die pad or leads | — | 2025-02-11 |
| 11929259 | Method for manufacturing leadless semiconductor package with wettable flanks | Aaron Cadag, Ela Mia Cadag | 2024-03-12 |
| 11862579 | Semiconductor device having cavities at an interface of an encapsulant and a die pad or leads | — | 2024-01-02 |
| 11393774 | Semiconductor device having cavities at an interface of an encapsulant and a die pad or leads | — | 2022-07-19 |
| 11069601 | Leadless semiconductor package with wettable flanks | Aaron Cadag, Ela Mia Cadag | 2021-07-20 |
| 10461019 | Package with backside protective layer during molding to prevent mold flashing failure | Aaron Cadag, Ela Mia Cadag | 2019-10-29 |
| 10128169 | Package with backside protective layer during molding to prevent mold flashing failure | Aaron Cadag, Ela Mia Cadag | 2018-11-13 |