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Method for manufacturing leadless semiconductor package with wettable flanks |
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Ela Mia Cadag, Frederick Ray Gomez |
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Method for manufacturing leadless semiconductor package with wettable flanks |
Ian Harvey Arellano, Ela Mia Cadag |
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Rohn Kenneth Serapio, Ela Mia Cadag |
2024-02-27 |
| 11557548 |
Package with interlocking leads and manufacturing the same |
Lester Joseph Belalo, Ela Mia Cadag |
2023-01-17 |
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Bottom package exposed die MEMS pressure sensor integrated circuit package design |
Frederick Arellano, Ernesto Antilano, Jr. |
2022-06-07 |
| 11069601 |
Leadless semiconductor package with wettable flanks |
Ian Harvey Arellano, Ela Mia Cadag |
2021-07-20 |
| 10910295 |
QFN pre-molded leadframe having a solder wettable sidewall on each lead |
Ernesto Antilano, Jr., Ela Mia Cadag |
2021-02-02 |
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Package with interlocking leads and manufacturing the same |
Lester Joseph Belalo, Ela Mia Cadag |
2021-01-26 |
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QFN pre-molded leadframe having a solder wettable sidewall on each lead |
Ernesto Antilano, Jr., Ela Mia Cadag |
2020-01-21 |
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Lester Joseph Belalo, Ela Mia Cadag |
2020-01-07 |
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Bottom package exposed die MEMS pressure sensor integrated circuit package design |
Frederick Arellano, Ernesto Antilano, Jr. |
2019-11-19 |
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Package with backside protective layer during molding to prevent mold flashing failure |
Ian Harvey Arellano, Ela Mia Cadag |
2019-10-29 |
| 10128169 |
Package with backside protective layer during molding to prevent mold flashing failure |
Ian Harvey Arellano, Ela Mia Cadag |
2018-11-13 |
| 10079198 |
QFN pre-molded leadframe having a solder wettable sidewall on each lead |
Ernesto Antilano, Jr., Ela Mia Cadag |
2018-09-18 |
| 9953933 |
Flow over wire die attach film and conductive molding compound to provide an electromagnetic interference shield for a semiconductor die |
Rennier Rodriguez, Ela Mia Cadag |
2018-04-24 |
| 9022773 |
Compensating mold plunger for integrated circuit manufacture |
BernieChrisanto Ang, Richard Laylo |
2015-05-05 |