Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12170240 | Lead frame for improving adhesive fillets on semiconductor die corners | Maiden Grace Maming, Jefferson Talledo | 2024-12-17 |
| 12159820 | Flat no-lead package with surface mounted structure | Aiza Marie Agudon, Maiden Grace Maming | 2024-12-03 |
| 12074100 | Flat no-lead package with surface mounted structure | Aiza Marie Agudon, Maiden Grace Maming | 2024-08-27 |
| 11688715 | Semiconductor die with multiple contact pads electrically coupled to a lead of a lead frame | Rammil Seguido, Raymond Albert Narvadez, Michael Tabiera | 2023-06-27 |
| 11664239 | Lead frame for improving adhesive fillets on semiconductor die corners | Maiden Grace Maming, Jefferson Talledo | 2023-05-30 |
| 11552007 | Modified leadframe design with adhesive overflow recesses | Aiza Marie Agudon, Jefferson Talledo, Moonlord Manalo, Ela Mia Cadag, Rammil Seguido | 2023-01-10 |
| 11404355 | Package with lead frame with improved lead design for discrete electrical components and manufacturing the same | Bryan Christian Bacquian, Maiden Grace Maming, David Gani | 2022-08-02 |
| 11152326 | Semiconductor die with multiple contact pads electrically coupled to a lead of a lead frame | Rammil Seguido, Raymond Albert Narvadez, Michael Tabiera | 2021-10-19 |
| 11037864 | Lead frame for improving adhesive fillets on semiconductor die corners | Maiden Grace Maming, Jefferson Talledo | 2021-06-15 |
| 10957634 | Modified leadframe design with adhesive overflow recesses | Aiza Marie Agudon, Jefferson Talledo, Moonlord Manalo, Ela Mia Cadag, Rammil Seguido | 2021-03-23 |
| 10892212 | Flat no-lead package with surface mounted structure | Aiza Marie Agudon, Maiden Grace Maming | 2021-01-12 |
| 10796984 | Leadframe having a conductive layer protruding through a lead recess | Raymond Albert Narvadez, Ernesto Antilano, Jr. | 2020-10-06 |
| 10763194 | Package with lead frame with improved lead design for discrete electrical components and manufacturing the same | Bryan Christian Bacquian, Maiden Grace Maming, David Gani | 2020-09-01 |
| 10615104 | Modified leadframe design with adhesive overflow recesses | Aiza Marie Agudon, Jefferson Talledo, Moonlord Manalo, Ela Mia Cadag, Rammil Seguido | 2020-04-07 |
| 10535588 | Die with metallized sidewall and method of manufacturing | Aiza Marie Agudon, Jefferson Talledo | 2020-01-14 |
| 10109563 | Modified leadframe design with adhesive overflow recesses | Aiza Marie Agudon, Jefferson Talledo, Moonlord Manalo, Ela Mia Cadag, Rammil Seguido | 2018-10-23 |
| 9953933 | Flow over wire die attach film and conductive molding compound to provide an electromagnetic interference shield for a semiconductor die | Aaron Cadag, Ela Mia Cadag | 2018-04-24 |
| 9761538 | Method for making a shielded integrated circuit (IC) package with an electrically conductive polymer layer | Frederick Arellano, Aiza Marie Agudon | 2017-09-12 |