Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11355423 | Bottom package exposed die MEMS pressure sensor integrated circuit package design | Aaron Cadag, Ernesto Antilano, Jr. | 2022-06-07 |
| 10483191 | Bottom package exposed die MEMS pressure sensor integrated circuit package design | Aaron Cadag, Ernesto Antilano, Jr. | 2019-11-19 |
| 9824979 | Electronic package having electromagnetic interference shielding and associated method | Godfrey Dimayuga, Michael Tabiera | 2017-11-21 |
| 9761538 | Method for making a shielded integrated circuit (IC) package with an electrically conductive polymer layer | Rennier Rodriguez, Aiza Marie Agudon | 2017-09-12 |