Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11715677 | Semiconductor device with frame having arms | Jefferson Talledo | 2023-08-01 |
| 11688715 | Semiconductor die with multiple contact pads electrically coupled to a lead of a lead frame | Rennier Rodriguez, Raymond Albert Narvadez, Michael Tabiera | 2023-06-27 |
| 11552007 | Modified leadframe design with adhesive overflow recesses | Rennier Rodriguez, Aiza Marie Agudon, Jefferson Talledo, Moonlord Manalo, Ela Mia Cadag | 2023-01-10 |
| 11152326 | Semiconductor die with multiple contact pads electrically coupled to a lead of a lead frame | Rennier Rodriguez, Raymond Albert Narvadez, Michael Tabiera | 2021-10-19 |
| 11004776 | Semiconductor device with frame having arms and related methods | Jefferson Talledo | 2021-05-11 |
| 10957634 | Modified leadframe design with adhesive overflow recesses | Rennier Rodriguez, Aiza Marie Agudon, Jefferson Talledo, Moonlord Manalo, Ela Mia Cadag | 2021-03-23 |
| 10615104 | Modified leadframe design with adhesive overflow recesses | Rennier Rodriguez, Aiza Marie Agudon, Jefferson Talledo, Moonlord Manalo, Ela Mia Cadag | 2020-04-07 |
| 10109563 | Modified leadframe design with adhesive overflow recesses | Rennier Rodriguez, Aiza Marie Agudon, Jefferson Talledo, Moonlord Manalo, Ela Mia Cadag | 2018-10-23 |
| 9947612 | Semiconductor device with frame having arms and related methods | Jefferson Talledo | 2018-04-17 |
| 9258890 | Support structure for stacked integrated circuit dies | Frederick Ray Gomez, Emmanuel Angeles | 2016-02-09 |
| 7089984 | Forming folded-stack packaged device using progressive folding tool | Ruel Pieda, Alan P. De Ocampo | 2006-08-15 |