Issued Patents All Time
Showing 25 most recent of 53 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12421108 | Capless semiconductor package with a micro-electromechanical system (mems) | — | 2025-09-23 |
| 12211772 | Method of manufacturing semiconductor devices and corresponding semiconductor device | Fulvio Vittorio Fontana, Davide Maria Benelli | 2025-01-28 |
| 12170240 | Lead frame for improving adhesive fillets on semiconductor die corners | Rennier Rodriguez, Maiden Grace Maming | 2024-12-17 |
| 12094725 | Leadframe package with pre-applied filler material | Frederick Ray Gomez | 2024-09-17 |
| 12080657 | Die embedded in substrate with stress buffer | — | 2024-09-03 |
| 11948868 | Compact leadframe package | — | 2024-04-02 |
| 11897763 | Capless semiconductor package with a micro-electromechanical system (MEMS) | — | 2024-02-13 |
| 11848256 | Semiconductor package having die pad with cooling fins | — | 2023-12-19 |
| 11715677 | Semiconductor device with frame having arms | Rammil Seguido | 2023-08-01 |
| 11699667 | Leadframe with pad anchoring members and method of forming the same | — | 2023-07-11 |
| 11664239 | Lead frame for improving adhesive fillets on semiconductor die corners | Rennier Rodriguez, Maiden Grace Maming | 2023-05-30 |
| 11658098 | Leadframe package with side solder ball contact and method of manufacturing | Tito Mangaoang | 2023-05-23 |
| 11610851 | Die embedded in substrate with stress buffer | — | 2023-03-21 |
| 11552007 | Modified leadframe design with adhesive overflow recesses | Rennier Rodriguez, Aiza Marie Agudon, Moonlord Manalo, Ela Mia Cadag, Rammil Seguido | 2023-01-10 |
| 11542152 | Semiconductor package with flexible interconnect | — | 2023-01-03 |
| 11398417 | Semiconductor package having die pad with cooling fins | — | 2022-07-26 |
| 11348863 | Semiconductor package having a semiconductor die on a plated conductive layer | — | 2022-05-31 |
| 11270894 | Manufacturing method for semiconductor package with cantilever pads | Godfrey Dimayuga | 2022-03-08 |
| 11227776 | Leadframe package with pre-applied filler material | Frederick Ray Gomez | 2022-01-18 |
| 11227817 | Compact leadframe package | — | 2022-01-18 |
| 11133241 | Semiconductor package with a cavity in a die pad for reducing voids in the solder | — | 2021-09-28 |
| 11037864 | Lead frame for improving adhesive fillets on semiconductor die corners | Rennier Rodriguez, Maiden Grace Maming | 2021-06-15 |
| 11031350 | Leadframe with pad anchoring members and method of forming the same | — | 2021-06-08 |
| 11004776 | Semiconductor device with frame having arms and related methods | Rammil Seguido | 2021-05-11 |
| 10957634 | Modified leadframe design with adhesive overflow recesses | Rennier Rodriguez, Aiza Marie Agudon, Moonlord Manalo, Ela Mia Cadag, Rammil Seguido | 2021-03-23 |