Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11404355 | Package with lead frame with improved lead design for discrete electrical components and manufacturing the same | Rennier Rodriguez, Maiden Grace Maming, David Gani | 2022-08-02 |
| 10763194 | Package with lead frame with improved lead design for discrete electrical components and manufacturing the same | Rennier Rodriguez, Maiden Grace Maming, David Gani | 2020-09-01 |
| 9177903 | Enhanced flip-chip die architecture | Bernie Chrisanto Ang | 2015-11-03 |