Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12051601 | Method of bonding substrates utilizing a substrate holder with holding fingers | Jun-Hyung Kim, Sung-Hyup Kim | 2024-07-30 |
| 11728200 | Wafer bonding apparatuses | Hoe Chul Kim, Seok Ho Kim, Hoon-Joo Na, Hyung Jun Jeon | 2023-08-15 |
| 11640912 | Apparatus for bonding substrates having a substrate holder with holding fingers and method of bonding substrates | Jun-Hyung Kim, Sung-Hyup Kim | 2023-05-02 |
| 11283235 | Semiconductor laser device | Pil-Kyu Kang, Seok Ho Kim, Hoe Chul Kim, Hoon-Joo Na | 2022-03-22 |
| 10999848 | Sparse-coded ambient backscatter communication method and system | Dong In Kim | 2021-05-04 |
| 10971379 | Wafer bonding apparatus and wafer bonding system using the same | Jun-Hyung Kim, Sung-Hyup Kim | 2021-04-06 |
| 10906283 | Wafer bonding apparatus for directly bonding wafers and a wafer bonding system having the same | Jun-Hyung Kim, Hoe Chul Kim, Hoon-Joo Na, Kwang-Jin Moon | 2021-02-02 |
| 10833047 | Apparatuses of bonding substrates and methods of bonding substrates | Hoe Chul Kim, Dong-Eog Kim | 2020-11-10 |
| 10763243 | Substrate bonding apparatus | Jun-Hyung Kim, Sung-Hyup Kim, Kyeong Bin Lim, Seok Ho Kim | 2020-09-01 |
| 10639875 | Wafer bonding apparatus and wafer bonding system including the same | Pil-Kyu Kang, Seok Ho Kim, Kwang-Jin Moon, Na-ein Lee, Ho-Jin Lee | 2020-05-05 |
| 10523302 | Apparatus and method for selecting beam pattern in communication system supporting beamforming scheme | Inkyu Lee, Jong-Ho Oh, Bong-Jin Kim, Min Ki Ahn, Tae-Seok Oh +1 more | 2019-12-31 |
| 10468400 | Method of manufacturing substrate structure | Pil-Kyu Kang, Seok Ho Kim, Kwang-Jin Moon, Ho-Jin Lee | 2019-11-05 |
| 10200889 | Method for receiving signal using distribution storage cache retention auxiliary node in wireless communication system, and apparatus therefor | Hanbyul Seo, Wan Choi, Dongin Kim, Bi Hong, Hojin Song | 2019-02-05 |
| 9941243 | Wafer-to-wafer bonding structure | Pil-Kyu Kang, Seok Ho Kim, Kwang-Jin Moon, Ho-Jin Lee | 2018-04-10 |
| 9935037 | Multi-stacked device having TSV structure | Pil-Kyu Kang, Ho-Jin Lee, Byung-Lyul Park, Seok Ho Kim | 2018-04-03 |
| 9865581 | Method of fabricating multi-substrate semiconductor devices | Joo-Hee Jang, Pil-Kyu Kang, Seok Ho Kim, Hyo Ju Kim, Byung-Lyul Park +4 more | 2018-01-09 |
| 9773660 | Wafer processing methods | Pil-Kyu Kang, Byung-Lyul Park, Jin-Ho Park | 2017-09-26 |
| 9520361 | Semiconductor devices | Pil-Kyu Kang, Seok Ho Kim, Hyo Ju Kim, Byung-Lyul Park, Joo-Hee Jang +1 more | 2016-12-13 |
| 9287251 | Method of manufacturing a semiconductor device | Pil-Kyu Kang, Seok Ho Kim, Hyo Ju Kim, Byung-Lyul Park, Yeun-Sang Park +4 more | 2016-03-15 |
| 9236349 | Semiconductor device including through via structures and redistribution structures | Kyu-Ha Lee, Pil-Kyu Kang, Ho-Jin Lee, Byung-Lyul Park, Gil-Heyun Choi | 2016-01-12 |