Issued Patents All Time
Showing 1–25 of 67 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12266609 | Semiconductor device and method for fabricating the same | Hyung Jun Jeon, Son-Kwan Hwang | 2025-04-01 |
| 12249557 | Semiconductor device including backside wiring structure with super via | Seung Ha Oh, Ho-Jin Lee | 2025-03-11 |
| 12170259 | Semiconductor package and method of fabricating the same | Ju Bin SEO, Seok Ho Kim | 2024-12-17 |
| 12014972 | Semiconductor devices including through-silicon-vias and methods of manufacturing the same and semiconductor packages including the semiconductor devices | Ju-Il Choi, Byung-Lyul Park, Jin Ho An, Atsushi Fujisaki | 2024-06-18 |
| 11804472 | Semiconductor device, semiconductor package and method of manufacturing the same | Hak Seung Lee, Tae-Seong Kim, Dae-Suk Lee, Dong-Chan Lim | 2023-10-31 |
| 11728297 | Semiconductor devices, semiconductor packages, and methods of manufacturing the semiconductor devices | Ju-Il Choi, Ju Bin SEO, Dong-Chan Lim, Atsushi Fujisaki, Ho-Jin Lee | 2023-08-15 |
| 11600552 | Semiconductor device having a through silicon via and methods of manufacturing the same | Ju Bin SEO, Su-Jeong Park, Tae-Seong Kim, Dong-Chan Lim, Ju-Il Choi | 2023-03-07 |
| 11488860 | Integrated circuit device and method of manufacturing the same | Su-Jeong Park, Dong-Chan Lim, Ju Bin SEO, Ju-Il Choi, Atsushi Fujisaki | 2022-11-01 |
| 11469202 | Semiconductor device | Seong Min Son, Jeong-gi Jin, Jin Ho An, Jin-ho Chun, Ho-Jin Lee | 2022-10-11 |
| 11417536 | Method for wafer planarization and an image sensor made by the same | Joo-Hee Jang, Seok Ho Kim, Hoon-Joo Na, Jae Hyung Park, Kyu-Ha Lee | 2022-08-16 |
| 11133277 | Semiconductor device bonded by bonding pads | Jin-Nam Kim, Tae-Seong Kim, Hoon-Joo Na | 2021-09-28 |
| 11094612 | Semiconductor devices including through-silicon-vias and methods of manufacturing the same and semiconductor packages including the semiconductor devices | Ju-Il Choi, Byung-Lyul Park, Jin Ho An, Atsushi Fujisaki | 2021-08-17 |
| 11069597 | Semiconductor chips and methods of manufacturing the same | Dae-Suk Lee, Hak Seung Lee, Dong-Chan Lim, Tae-Seong Kim | 2021-07-20 |
| 11043445 | Semiconductor device having a through silicon via and methods of manufacturing the same | Ju Bin SEO, Su-Jeong Park, Tae-Seong Kim, Dong-Chan Lim, Ju-Il Choi | 2021-06-22 |
| 11018101 | Semiconductor devices, semiconductor packages, and methods of manufacturing the semiconductor devices | Ju-Il Choi, Ju Bin SEO, Dong-Chan Lim, Atsushi Fujisaki, Ho-Jin Lee | 2021-05-25 |
| 10978655 | Semiconductor devices | Yi Koan Hong, Nae-In Lee, Ho-Jin Lee | 2021-04-13 |
| 10950578 | Semiconductor device, semiconductor package and method of manufacturing the same | Hak Seung Lee, Tae-Seong Kim, Dae-Suk Lee, Dong-Chan Lim | 2021-03-16 |
| 10906283 | Wafer bonding apparatus for directly bonding wafers and a wafer bonding system having the same | Tae-Yeong Kim, Jun-Hyung Kim, Hoe Chul Kim, Hoon-Joo Na | 2021-02-02 |
| 10833032 | Semiconductor device | Seong Min Son, Jeong-gi Jin, Jin Ho An, Jin-ho Chun, Ho-Jin Lee | 2020-11-10 |
| 10770447 | Method for fabricating substrate structure and substrate structure fabricated by using the method | Ho-Jin Lee, Seok Ho Kim, Byung-Lyul Park, Nae-In Lee | 2020-09-08 |
| 10763163 | Integrated circuit device and method of manufacturing the same | Su-Jeong Park, Dong-Chan Lim, Ju Bin SEO, Ju-Il Choi, Atsushi Fujisaki | 2020-09-01 |
| 10639875 | Wafer bonding apparatus and wafer bonding system including the same | Tae-Yeong Kim, Pil-Kyu Kang, Seok Ho Kim, Na-ein Lee, Ho-Jin Lee | 2020-05-05 |
| 10580726 | Semiconductor devices and semiconductor packages including the same, and methods of manufacturing the semiconductor devices | Jin-ho Chun, Seong Min Son, Hyung Jun Jeon, Jin Ho An, Ho-Jin Lee +1 more | 2020-03-03 |
| 10468400 | Method of manufacturing substrate structure | Pil-Kyu Kang, Seok Ho Kim, Tae-Yeong Kim, Ho-Jin Lee | 2019-11-05 |
| 10446774 | Semiconductor devices | Yi Koan Hong, Nae-In Lee, Ho-Jin Lee | 2019-10-15 |