Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11798906 | Semiconductor chip | Nae-In Lee, Jum-Yong Park, Jin-ho Chun, Seong Min Son, Ho-Jin Lee | 2023-10-24 |
| 11469202 | Semiconductor device | Seong Min Son, Jin Ho An, Jin-ho Chun, Kwang-Jin Moon, Ho-Jin Lee | 2022-10-11 |
| 11251144 | Semiconductor chip | Nae-In Lee, Jum-Yong Park, Jin-ho Chun, Seong Min Son, Ho-Jin Lee | 2022-02-15 |
| 10833032 | Semiconductor device | Seong Min Son, Jin Ho An, Jin-ho Chun, Kwang-Jin Moon, Ho-Jin Lee | 2020-11-10 |
| 10483224 | Semiconductor chip | Nae-In Lee, Jum-Yong Park, Jin-ho Chun, Seong Min Son, Ho-Jin Lee | 2019-11-19 |
| 9735090 | Integrated circuit devices having through-silicon vias and methods of manufacturing such devices | Ju-Il Choi, Atsushi Fujisaki, Byung-Iyul Park, Ji-Soon Park, Joo-Hee Jang | 2017-08-15 |
| 9240366 | Semiconductor device, semiconductor package, and electronic system | Ho Joon Lee, Ji-Woong Sue, Joo-Hee Jang | 2016-01-19 |
| 9214411 | Integrated circuit devices including a through-silicon via structure and methods of fabricating the same | Jae-Hwa Park, Kwang-Jin Moon, Suk-Chul Bang, Byung-Iyul Park, Tae-Seong Kim +1 more | 2015-12-15 |
| 9082680 | Joint structures having organic preservative films | Ju-Il Choi, Ui-Hyoung Lee, Hyung Seok Kim, Jeong Woo Park | 2015-07-14 |
| 8987869 | Integrated circuit devices including through-silicon-vias having integral contact pads | Jeong Woo Park, Ju-Il Choi | 2015-03-24 |
| 7843072 | Semiconductor package having through holes | Sung Su Park, Jin Young Kim | 2010-11-30 |