Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10153219 | Fan out wafer level package type semiconductor package and package on package type semiconductor package including the same | Hyung Jun Jeon, Nae-In Lee | 2018-12-11 |
| 9735090 | Integrated circuit devices having through-silicon vias and methods of manufacturing such devices | Ju-Il Choi, Atsushi Fujisaki, Ji-Soon Park, Joo-Hee Jang, Jeong-gi Jin | 2017-08-15 |
| 9698051 | Semiconductor chips having through silicon vias and related fabrication methods and semiconductor packages | Jin-ho Chun, Hyun-Soo Chung, Gil-Heyun Choi, Son-Kwan Hwang | 2017-07-04 |
| 9530726 | Semiconductor device and method of fabricating the same | Kwang-Jin Moon, Dong-Chan Lim, Deok-Young Jung, Gil-Heyun Choi, Dae-Lok Bae +1 more | 2016-12-27 |
| 9214411 | Integrated circuit devices including a through-silicon via structure and methods of fabricating the same | Jae-Hwa Park, Kwang-Jin Moon, Suk-Chul Bang, Jeong-gi Jin, Tae-Seong Kim +1 more | 2015-12-15 |
| 8426308 | Method of forming through silicon via of semiconductor device using low-k dielectric material | Kyu-Hee Han, Sang-Hoon Ahn, Jang-Hee Lee, Jong-min Beak, Kyoung-Hee Kim +1 more | 2013-04-23 |