| 9831164 |
Semiconductor device and method of fabricating the same |
Kwang-Jin Moon, Pil-Kyu Kang, Gil-Heyun Choi, Byung-Lyul Park, Dong-Chan Lim +1 more |
2017-11-28 |
| 9530726 |
Semiconductor device and method of fabricating the same |
Kwang-Jin Moon, Byung-Iyul Park, Dong-Chan Lim, Deok-Young Jung, Gil-Heyun Choi +1 more |
2016-12-27 |
| 9103974 |
Semiconductor devices having optical transceiver |
Pil-Kyu Kang, Byung-Lyul Park, Gil-Heyun Choi |
2015-08-11 |
| 8958002 |
Image sensors |
Sang-jun Choi, Yoon-dong Park, Chris Hong, Jung-Chak Ahn, Chang-Rok Moon +3 more |
2015-02-17 |
| 8873901 |
Buried-type optical input/output devices and methods of manufacturing the same |
Pil-Kyu Kang, Byung-Lyul Park, Gil-Heyun Choi |
2014-10-28 |
| 8867882 |
Optical input/output device for photo-electric integrated circuit device and method of fabricating same |
Pil-Kyu Kang, Gil-Heyun Choi, Jong-Myeong Lee |
2014-10-21 |
| 8791405 |
Optical waveguide and coupler apparatus and method of manufacturing the same |
Ho-Chul Ji, Ki-Nam Kim, Yong-Woo Hyung, Kyoung-won Na, Kyoung-ho Ha +7 more |
2014-07-29 |
| 8735265 |
Methods of selectively forming silicon-on-insulator structures using selective expitaxial growth process |
Pil-Kyu Kang, Gil-Heyun Choi, Jong-Myeong Lee |
2014-05-27 |
| 8570409 |
Image sensors and methods of manufacturing image sensors |
Sang-jun Choi, Yoon-dong Park, Chris Hong, Jung-Chak Ahn, Chang-Rok Moon +3 more |
2013-10-29 |
| 8546162 |
Method for forming light guide layer in semiconductor substrate |
Byung-Lyul Park, Pil-Kyu Kang, Gil-Heyun Choi, Kwang-Jin Moon |
2013-10-01 |
| 8422845 |
Optical input/output device for photo-electric integrated circuit device and method of fabricating same |
Pil-Kyu Kang, Gil-Heyun Choi, Jong-Myeong Lee |
2013-04-16 |
| 8390120 |
Semiconductor device and method of fabricating the same |
Kwang-Jin Moon, Pil-Kyu Kang, Gil-Heyun Choi, Byung-Lyul Park, Dong-Chan Lim +1 more |
2013-03-05 |
| 8354308 |
Conductive layer buried-type substrate, method of forming the conductive layer buried-type substrate, and method of fabricating semiconductor device using the conductive layer buried-type substrate |
Pil-Kyu Kang, Gil-Heyun Choi, Byung-Lyul Park, Dong-kak Lee |
2013-01-15 |
| 8343851 |
Wafer temporary bonding method using silicon direct bonding |
Jung Ho Kim, Jong-Wook Lee, Seung Woo Choi, Pil-Kyu Kang |
2013-01-01 |
| 8324055 |
Methods of manufacturing buried wiring type substrate and semiconductor device incorporating buried wiring type substrate |
Pil-Kyu Kang, Gil-Heyun Choi, Jong-Myeong Lee |
2012-12-04 |
| 8319329 |
Stacked integrated circuit package having recessed sidewalls |
Pil-Kyu Kang, Jung Ho Kim, Jong-Wook Lee, Seung Woo Choi |
2012-11-27 |
| 8129833 |
Stacked integrated circuit packages that include monolithic conductive vias |
Pil-Kyu Kang, Jung Ho Kim, Jong-Wook Lee, Seung Woo Choi |
2012-03-06 |
| 7932163 |
Methods of forming stacked semiconductor devices with single-crystal semiconductor regions |
Jong-Heun Lim, Chang-Ki Hong, Bo-Un Yoon, Seong-Kyu Yun, Suk-Hun Choi |
2011-04-26 |
| 7781302 |
Methods of fabricating semiconductor devices having isolation regions formed from annealed oxygen ion implanted regions |
Yong-Won Cha |
2010-08-24 |
| 7605022 |
Methods of manufacturing a three-dimensional semiconductor device and semiconductor devices fabricated thereby |
Yong-Won Cha, Dong-Chul SUH |
2009-10-20 |
| 6437445 |
Niobium-near noble metal contact structures for integrated circuits |
Chong-Mu Lee, Young Jae Kwon, Young-Wug Kim |
2002-08-20 |
| 6150249 |
Methods of forming niobium-near noble metal contact structures for integrated circuits |
Chong-Mu Lee, Young Jae Kwon, Young-Wug Kim |
2000-11-21 |
