YC

Yong-Won Cha

Samsung: 8 patents #15,984 of 75,807Top 25%
Overall (All Time): #403,714 of 4,157,543Top 10%
12
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
12027486 Substrate bonding apparatus Mi Ok Cho, Ji Soo Cho, Dae Hyeon KIM 2024-07-02
8999099 Substrate bonding system and mobile chamber used thereto Sang Wook Yoo, Gun Woo Park, Seung Hee JUNG 2015-04-07
8278186 Wafer cleaning method and wafer bonding method using the same Dong Chul Kim 2012-10-02
7781302 Methods of fabricating semiconductor devices having isolation regions formed from annealed oxygen ion implanted regions Dae-Lok Bae 2010-08-24
7605022 Methods of manufacturing a three-dimensional semiconductor device and semiconductor devices fabricated thereby Dong-Chul SUH, Dae-Lok Bae 2009-10-20
7598177 Methods of filling trenches using high-density plasma deposition (HDP) Kyu-Tae Na 2009-10-06
7560383 Method of forming a thin layer and method of manufacturing a non-volatile semiconductor device using the same Kyong-Hee Joo, Seung Hyun Lim, In-Seok Yeo, Kyu-Tae Na 2009-07-14
7470603 Methods of fabricating semiconductor devices having laser-formed single crystalline active structures Sung-Kwan Kang, Pil-Kyu Kang, Yong-Hoon Son, Jong-Wook Lee 2008-12-30
7332409 Methods of forming trench isolation layers using high density plasma chemical vapor deposition Kyu-Tae Na, Yong-Soon Choi, Eunkee Hong, Ju-Seon Goo 2008-02-19
7056827 Methods of filling trenches using high-density plasma deposition (HDP) Kyu-Tae Na 2006-06-06
7033908 Methods of forming integrated circuit devices including insulation layers Won Jin Kim 2006-04-25
6647957 Fuel control valve for preventing sudden start of automobile 2003-11-18