Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12199014 | Semiconductor device and a manufacturing method thereof | Kyeong Bin Lim, Hyo Ju Kim, Ho Chang Lee, Jeong Min Na | 2025-01-14 |
| 12051601 | Method of bonding substrates utilizing a substrate holder with holding fingers | Jun-Hyung Kim, Tae-Yeong Kim | 2024-07-30 |
| 11640912 | Apparatus for bonding substrates having a substrate holder with holding fingers and method of bonding substrates | Jun-Hyung Kim, Tae-Yeong Kim | 2023-05-02 |
| 11127654 | Semiconductor device and a manufacturing method thereof | Kyeong Bin Lim, Hyo Ju Kim, Ho Chang Lee, Jeong Min Na | 2021-09-21 |
| 10971379 | Wafer bonding apparatus and wafer bonding system using the same | Jun-Hyung Kim, Tae-Yeong Kim | 2021-04-06 |
| 10937670 | Megasonic cleaner | Sung Yong Park, Sung-Gwang Lee, Kwang-Sung Lee | 2021-03-02 |
| 10811287 | Spin coater and substrate treating apparatus having the same | Hyun Joo Jeon | 2020-10-20 |
| 10811381 | Wafer to wafer bonding method and wafer to wafer bonding system | Joon Ho Lee, Ki Ju Sohn | 2020-10-20 |
| 10763243 | Substrate bonding apparatus | Jun-Hyung Kim, Kyeong Bin Lim, Seok Ho Kim, Tae-Yeong Kim | 2020-09-01 |
| 10295564 | Apparatus for clamping a probe card and probe card including the same | Sung Yong Park, Sang-Boo Kang, Jae Geun Kim, Jeong Min Na, Jae-Hyoung Park +2 more | 2019-05-21 |
| 9791855 | Semiconductor process management system, semiconductor manufacturing system including the same, and method of manufacturing semiconductor | Dong Hoon Han, Jai-Hyung Won, Do Hyung Kim, Ho Jun Kim | 2017-10-17 |
| 7792453 | Image forming apparatus with opening/closing member | Sung Ku Baek, Sun Soo Kim, Gyu Deok Hwang, Jong Woo Kim, Hyun Ki Cho +2 more | 2010-09-07 |