Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12342601 | Semiconductor device | Nam Gyu Cho, Rak-Hwan Kim, Hyeok-Jun Son, Won Keun Chung | 2025-06-24 |
| 12165916 | Semiconductor device | Won Keun Chung, Joon-Gon Lee, Rak-Hwan Kim, Chung Hwan Shin, Nam Gyu Cho | 2024-12-10 |
| 11881519 | Semiconductor device | Nam Gyu Cho, Rak-Hwan Kim, Hyeok-Jun Son, Won Keun Chung | 2024-01-23 |
| 11367651 | Semiconductor device | Won Keun Chung, Joon-Gon Lee, Rak-Hwan Kim, Chung Hwan Shin, Nam Gyu Cho | 2022-06-21 |
| 11349007 | Semiconductor device | Nam Gyu Cho, Rak-Hwan Kim, Hyeok-Jun Son, Won Keun Chung | 2022-05-31 |
| 10403717 | Semiconductor devices including contact structures that partially overlap silicide layers | Chang Woo Sohn, Chul-Sung Kim, Shigenobu Maeda, Young-Moon Choi, Hyo-Seok Choi +1 more | 2019-09-03 |
| 10262937 | Integrated circuit device | Joon-Gon Lee, Ryuji Tomita, Chul-Sung Kim, Do Hyun Lee | 2019-04-16 |
| 10242917 | Semiconductor devices including active fins and methods of manufacturing the same | Dong Woo Kim, Shigenobu Maeda, Young-Moon Choi, Yong-Bum Kwon, Chang Woo Sohn | 2019-03-26 |
| 10128245 | Semiconductor devices including active areas with increased contact area | Joon-Gon Lee, Na Rae Kim, Chul-Sung Kim, Do Hyun Lee, Ryuji Tomita +1 more | 2018-11-13 |
| 10079210 | Integrated circuit device and method of fabricating the same | Do Hyun Lee, Chul-Sung Kim, Sang-Jin Hyun, Joon-Gon Lee | 2018-09-18 |
| 9768255 | Semiconductor devices including contact structures that partially overlap silicide layers | Chang Woo Sohn, Chul-Sung Kim, Shigenobu Maeda, Young-Moon Choi, Hyo-Seok Choi +1 more | 2017-09-19 |
| 9728601 | Semiconductor devices including active fins and methods of manufacturing the same | Dong Woo Kim, Shigenobu Maeda, Young-Moon Choi, Yong-Bum Kwon, Chang Woo Sohn | 2017-08-08 |
| 9496218 | Integrated circuit device having through-silicon-via structure | Kun-Sang Park, Byung-Lyul Park, Seong Min Son, Gil-Heyun Choi | 2016-11-15 |
| 9006902 | Semiconductor devices having through silicon vias and methods of fabricating the same | Ju-Il Choi, Su Kyoung Kim, Kun-Sang Park, Seong Min Son, Jin Ho An | 2015-04-14 |
| 8884440 | Integrated circuit device including through-silicon via structure having offset interface | Su Kyoung Kim, Gil-Heyun Choi, Byung-Lyul Park, Kwang-Jin Moon, Kun-Sang Park +1 more | 2014-11-11 |
| 8860221 | Electrode connecting structures containing copper | Kun-Sang Park, Byung-Lyul Park, Su Kyoung Kim, Kwang-Jin Moon, Suk-Chul Bang +2 more | 2014-10-14 |
| 8497157 | Method of manufacturing a semiconductor device and method of manufacturing a semiconductor package including the same | Kwang-Jin Moon, Byung-Lyul Park, Gil-Heyun Choi, Suk-Chul Bang, Dong-Chan Lim +1 more | 2013-07-30 |