| 12342601 |
Semiconductor device |
Nam Gyu Cho, Rak-Hwan Kim, Hyeok-Jun Son, Won Keun Chung |
2025-06-24 |
| 12165916 |
Semiconductor device |
Won Keun Chung, Joon-Gon Lee, Rak-Hwan Kim, Chung Hwan Shin, Nam Gyu Cho |
2024-12-10 |
| 11881519 |
Semiconductor device |
Nam Gyu Cho, Rak-Hwan Kim, Hyeok-Jun Son, Won Keun Chung |
2024-01-23 |
| 11367651 |
Semiconductor device |
Won Keun Chung, Joon-Gon Lee, Rak-Hwan Kim, Chung Hwan Shin, Nam Gyu Cho |
2022-06-21 |
| 11349007 |
Semiconductor device |
Nam Gyu Cho, Rak-Hwan Kim, Hyeok-Jun Son, Won Keun Chung |
2022-05-31 |
| 10403717 |
Semiconductor devices including contact structures that partially overlap silicide layers |
Chang Woo Sohn, Chul-Sung Kim, Shigenobu Maeda, Young-Moon Choi, Hyo-Seok Choi +1 more |
2019-09-03 |
| 10262937 |
Integrated circuit device |
Joon-Gon Lee, Ryuji Tomita, Chul-Sung Kim, Do Hyun Lee |
2019-04-16 |
| 10242917 |
Semiconductor devices including active fins and methods of manufacturing the same |
Dong Woo Kim, Shigenobu Maeda, Young-Moon Choi, Yong-Bum Kwon, Chang Woo Sohn |
2019-03-26 |
| 10128245 |
Semiconductor devices including active areas with increased contact area |
Joon-Gon Lee, Na Rae Kim, Chul-Sung Kim, Do Hyun Lee, Ryuji Tomita +1 more |
2018-11-13 |
| 10079210 |
Integrated circuit device and method of fabricating the same |
Do Hyun Lee, Chul-Sung Kim, Sang-Jin Hyun, Joon-Gon Lee |
2018-09-18 |
| 9768255 |
Semiconductor devices including contact structures that partially overlap silicide layers |
Chang Woo Sohn, Chul-Sung Kim, Shigenobu Maeda, Young-Moon Choi, Hyo-Seok Choi +1 more |
2017-09-19 |
| 9728601 |
Semiconductor devices including active fins and methods of manufacturing the same |
Dong Woo Kim, Shigenobu Maeda, Young-Moon Choi, Yong-Bum Kwon, Chang Woo Sohn |
2017-08-08 |
| 9496218 |
Integrated circuit device having through-silicon-via structure |
Kun-Sang Park, Byung-Lyul Park, Seong Min Son, Gil-Heyun Choi |
2016-11-15 |
| 9006902 |
Semiconductor devices having through silicon vias and methods of fabricating the same |
Ju-Il Choi, Su Kyoung Kim, Kun-Sang Park, Seong Min Son, Jin Ho An |
2015-04-14 |
| 8884440 |
Integrated circuit device including through-silicon via structure having offset interface |
Su Kyoung Kim, Gil-Heyun Choi, Byung-Lyul Park, Kwang-Jin Moon, Kun-Sang Park +1 more |
2014-11-11 |
| 8860221 |
Electrode connecting structures containing copper |
Kun-Sang Park, Byung-Lyul Park, Su Kyoung Kim, Kwang-Jin Moon, Suk-Chul Bang +2 more |
2014-10-14 |
| 8497157 |
Method of manufacturing a semiconductor device and method of manufacturing a semiconductor package including the same |
Kwang-Jin Moon, Byung-Lyul Park, Gil-Heyun Choi, Suk-Chul Bang, Dong-Chan Lim +1 more |
2013-07-30 |
