Issued Patents All Time
Showing 76–100 of 104 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8696921 | Method of manufacturing a semiconductor device | Jin-Ho Park, Gil-Heyun Choi, Jong-Myeong Lee, Zung-Sun Choi, Hye-Kyung Jung | 2014-04-15 |
| 8691692 | Semiconductor chips and methods of forming the same | Dong-Chan Lim, Gilheyun Choi, Kwangjin Moon, Deok-Young Jung, Dosun Lee | 2014-04-08 |
| 8592310 | Methods of manufacturing a semiconductor device | Gil-Heyun Choi, Suk-Chul Bang, Kwang-Jin Moon, Dong-Chan Lim, Deok-Young Jung | 2013-11-26 |
| 8581334 | Via structures and semiconductor devices having the via structures | Dong-Chan Lim, Gil-Heyun Choi, Sang-Hoon Ahn, Jong-Myeong Lee | 2013-11-12 |
| 8564139 | Semiconductor devices including protected barrier layers | Ho-Jin Lee, Pil-Kyu Kang, Seokho Kim, Kyu-Ha Lee, Hyunsoo Chung +1 more | 2013-10-22 |
| 8551860 | Semiconductor devices having through electrodes and methods of fabricating the same | Sukchul Bang, Kwangjin Moon, Dosun Lee, Deok-Young Jung, Gilheyun Choi | 2013-10-08 |
| 8546162 | Method for forming light guide layer in semiconductor substrate | Dae-Lok Bae, Pil-Kyu Kang, Gil-Heyun Choi, Kwang-Jin Moon | 2013-10-01 |
| 8546256 | Method of forming semiconductor device | Deok-Young Jung, Gil-Heyun Choi, Suk-Chul Bang, Kwang-Jin Moon, Dong-Chan Lim | 2013-10-01 |
| 8497157 | Method of manufacturing a semiconductor device and method of manufacturing a semiconductor package including the same | Kwang-Jin Moon, Do-Sun Lee, Gil-Heyun Choi, Suk-Chul Bang, Dong-Chan Lim +1 more | 2013-07-30 |
| 8390120 | Semiconductor device and method of fabricating the same | Kwang-Jin Moon, Pil-Kyu Kang, Dae-Lok Bae, Gil-Heyun Choi, Dong-Chan Lim +1 more | 2013-03-05 |
| 8354308 | Conductive layer buried-type substrate, method of forming the conductive layer buried-type substrate, and method of fabricating semiconductor device using the conductive layer buried-type substrate | Pil-Kyu Kang, Gil-Heyun Choi, Dae-Lok Bae, Dong-kak Lee | 2013-01-15 |
| 8319348 | Metal interconnect of semiconductor device | Jongmyeong Lee, Zungsun Choi, Gilheyun Choi, Jinho Park, Hye-Kyung Jung | 2012-11-27 |
| 8278207 | Methods of manufacturing semiconductor devices | Jin-Ho Park, Gil-Heyun Choi, Jong-Myeong Lee, Zung-Sun Choi, Hye-Kyung Jung | 2012-10-02 |
| 8076234 | Semiconductor device and method of fabricating the same including a conductive structure is formed through at least one dielectric layer after forming a via structure | Gil-Heyun Choi, Suk-Chul Bang, Kwang-Jin Moon, Dong-Chan Lim, Deok-Young Jung | 2011-12-13 |
| 8044490 | Semiconductor device including fuse | Seung Woo Shin, Jong-Myeong Lee, Gil-Heyun Choi, Jong-Ho Yun | 2011-10-25 |
| 8043960 | Contact structure of semiconductor devices and method of fabricating the same | Jung-Hwan Oh, Hong-Seong Son | 2011-10-25 |
| 7737038 | Method of fabricating semiconductor device including planarizing conductive layer using parameters of pattern density and depth of trenches | Seung-Mahn Lee, MooJin Jung | 2010-06-15 |
| 7348277 | Methods of fabricating semiconductor device using sacrificial layer | Ja-Eung Koo | 2008-03-25 |
| 7180188 | Contact structure of semiconductor devices and method of fabricating the same | Jung-Hwan Oh, Hong-Seong Son | 2007-02-20 |
| 6924234 | Method and apparatus for polishing a copper layer and method for forming a wiring structure using copper | Ja-Hyung Han, Sang-rok Hah, Hong-Seong Son, Duk-Ho Hong | 2005-08-02 |
| 6596581 | Method for manufacturing a semiconductor device having a metal-insulator-metal capacitor and a damascene wiring layer structure | Ju-Hyuk Chung, Ja-Hyung Han | 2003-07-22 |
| 6399457 | Semiconductor device having capacitor and method of manufacturing the same | Myoung-Bum Lee, Hyeon-Deok Lee | 2002-06-04 |
| 6261890 | Semiconductor device having capacitor and method of manufacturing the same | Myoung-Bum Lee, Hyeon-Deok Lee | 2001-07-17 |
| 6211082 | Chemical vapor deposition of tungsten using nitrogen-containing gas | Bong-young Yoo, Dae-hong Ko, Sang In Lee | 2001-04-03 |
| 6087257 | Methods of fabricating a selectively deposited tungsten nitride layer and metal wiring using a tungsten nitride layer | Jung-Min Ha, Dae-hong Ko, Sang In Lee | 2000-07-11 |