Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7737038 | Method of fabricating semiconductor device including planarizing conductive layer using parameters of pattern density and depth of trenches | Byung-Lyul Park, MooJin Jung | 2010-06-15 |
| 6821309 | Chemical-mechanical polishing slurry for polishing of copper or silver films | Rajiv Singh | 2004-11-23 |