Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7435673 | Methods of forming integrated circuit devices having metal interconnect structures therein | Kyoung-Woo Lee, Ja-Hum Ku, Wan Jae Park | 2008-10-14 |
| 7282451 | Methods of forming integrated circuit devices having metal interconnect layers therein | Kyoung-Woo Lee, Markus Naujok, Roman Knoefler | 2007-10-16 |
| 7166019 | Flexible membrane for a polishing head and chemical mechanical polishing (CMP) apparatus having the same | Moo-Yong Park, Ja-Eung Koo, Sang Cheol Han | 2007-01-23 |
| 6976902 | Chemical mechanical polishing apparatus | Ja-Eung Koo, Jong Won Lee, Sung Bae Lee, Sang-rok Hah, Hong-Seong Son | 2005-12-20 |
| 6924234 | Method and apparatus for polishing a copper layer and method for forming a wiring structure using copper | Ja-Hyung Han, Sang-rok Hah, Hong-Seong Son, Byung-Lyul Park | 2005-08-02 |