Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10056458 | Siloxane and organic-based MOL contact patterning | Chang Ho Maeng, Andy Wei, Anthony Ozzello, Bharat Krishnan, Guillaume Bouche +9 more | 2018-08-21 |
| 9385192 | Shallow trench isolation integration methods and devices formed thereby | Hongliang Shen, Kyutae Na, Sandeep Gaan, Hsin-Neng Tai, Weihua Tong +6 more | 2016-07-05 |
| 9123771 | Shallow trench isolation integration methods and devices formed thereby | Hongliang Shen, Kyutae Na, Sandeep Gaan, Hsin-Neng Tai, Weihua Tong +6 more | 2015-09-01 |
| 7488235 | Polishing apparatus and related polishing methods | Moo-Yong Park, Sang-rok Hah, Jong-Gyoon Kim, Hong-Seong Son | 2009-02-10 |
| 7214123 | Retainer ring, Polishing head, and chemical mechanical polishing apparatus | — | 2007-05-08 |
| 7066785 | Polishing apparatus and related polishing methods | Moo-Yong Park, Sang-rok Hah, Jong-Gyoon Kim, Hong-Seong Son | 2006-06-27 |
| 6924234 | Method and apparatus for polishing a copper layer and method for forming a wiring structure using copper | Sang-rok Hah, Hong-Seong Son, Duk-Ho Hong, Byung-Lyul Park | 2005-08-02 |
| 6913972 | Method of fabrication on a gate pattern of a non-volatile memory device | Myung-sik Han, Kyung-Hyun Kim, Chang-Ki Hong | 2005-07-05 |
| 6596581 | Method for manufacturing a semiconductor device having a metal-insulator-metal capacitor and a damascene wiring layer structure | Byung-Lyul Park, Ju-Hyuk Chung | 2003-07-22 |
| 6475914 | Method of manufacturing semiconductor device for protecting Cu layer from post chemical mechanical polishing-corrosion | — | 2002-11-05 |