DaeWook Yang — 8 Patents at Stats Chippac

DaeWook Yang has been granted 8 US patents while listed as an inventor at Stats Chippac. The first was granted in 2013 and the most recent in June 2015. DaeWook Yang ranks #600,572 of 4,157,543 US inventors in our database (top 14.4%). Patent records list DaeWook Yang in Godeok-myeon, KR.

Patents per Year

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Showing 1–8 of 8 patents

Patent #	Title	Co-Inventors	Date
9053953	Integrated circuit packaging system with underfill and method of manufacture thereof	KyungHoon Lee, Sunmi Kim	2015-06-09
8936969	Semiconductor device and method of singulating semiconductor wafer along modified region within non-active region formed by irradiating energy through mounting tape	HunTeak Lee, Yeongbeom Ko	2015-01-20
8841782	Integrated circuit package system with mold gate	Youngcheol Kim, Tae Keun Lee	2014-09-23
8836097	Semiconductor device and method of forming pre-molded substrate to reduce warpage during die molding	Seungwon Kim, Minjung Kim	2014-09-16
8716108	Integrated circuit packaging system with ultra-thin chip and method of manufacture thereof	Hun Teak Lee, Yeongbeom Ko	2014-05-06
8709877	Integrated circuit packaging system with an encapsulation and method of manufacture thereof	Yeongbeom Ko	2014-04-29
8421201	Integrated circuit packaging system with underfill and methods of manufacture thereof	KyungHoon Lee, Sunmi Kim	2013-04-16
8409918	Semiconductor device and method of forming pre-molded substrate to reduce warpage during die mounting	Seungwon Kim, Minjung Kim	2013-04-02

DaeWook Yang — 8 Patents

Patents per Year

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