Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9053953 | Integrated circuit packaging system with underfill and method of manufacture thereof | KyungHoon Lee, Sunmi Kim | 2015-06-09 |
| 8936969 | Semiconductor device and method of singulating semiconductor wafer along modified region within non-active region formed by irradiating energy through mounting tape | HunTeak Lee, Yeongbeom Ko | 2015-01-20 |
| 8841782 | Integrated circuit package system with mold gate | Youngcheol Kim, Tae Keun Lee | 2014-09-23 |
| 8836097 | Semiconductor device and method of forming pre-molded substrate to reduce warpage during die molding | Seungwon Kim, Minjung Kim | 2014-09-16 |
| 8716108 | Integrated circuit packaging system with ultra-thin chip and method of manufacture thereof | Hun Teak Lee, Yeongbeom Ko | 2014-05-06 |
| 8709877 | Integrated circuit packaging system with an encapsulation and method of manufacture thereof | Yeongbeom Ko | 2014-04-29 |
| 8421201 | Integrated circuit packaging system with underfill and methods of manufacture thereof | KyungHoon Lee, Sunmi Kim | 2013-04-16 |
| 8409918 | Semiconductor device and method of forming pre-molded substrate to reduce warpage during die mounting | Seungwon Kim, Minjung Kim | 2013-04-02 |