SK

Sunmi Kim

SC Stats Chippac: 7 patents #121 of 425Top 30%
TL Takeda Pharmaceutical Company Limited: 4 patents #338 of 1,531Top 25%
SC Semes Co.: 2 patents #274 of 991Top 30%
LG: 2 patents #13,302 of 26,165Top 55%
HC Hanwha Techwin Co.: 1 patents #208 of 523Top 40%
SI Siltron: 1 patents #37 of 72Top 55%
Overall (All Time): #261,692 of 4,157,543Top 7%
17
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
12202797 Method for producing pyrrole compound Takashi Ouchi, Giho Goh, Jinsoon Choi, Hunsoo Park 2025-01-21
11897005 Nozzle, substrate processing apparatus including the same, and substrate processing method Oh Jin Kwon, Sehyeong Choi 2024-02-13
11649206 Method for producing pyrrole compound Takashi Ouchi, Giho Goh, Jinsoon Choi, Hunsoo Park 2023-05-16
11529655 Nozzle, substrate processing apparatus including the same, and substrate processing method Oh Jin Kwon, Sehyeong Choi 2022-12-20
11066362 Method for producing pyrrole compound Takashi Ouchi, Giho Goh, Jinsoon Choi, Hunsoo Park 2021-07-20
10979645 Video capturing device including cameras and video capturing system including the same Daesang Kim 2021-04-13
10570091 Method for producing pyrrole compound Takashi Ouchi, Giho Goh, Jinsoon Choi, Hunsoo Park 2020-02-25
9574295 Washing machine and method of controlling same Dowan KIM, Youngkee Oh 2017-02-21
9543258 Semiconductor device and method of forming holes in substrate to interconnect top shield and ground shield OhHan Kim, KyungHoon Lee 2017-01-10
9293349 Semiconductor device and method of forming holes in substrate to interconnect top shield and ground shield OhHan Kim, KyungHoon Lee 2016-03-22
9053953 Integrated circuit packaging system with underfill and method of manufacture thereof KyungHoon Lee, DaeWook Yang 2015-06-09
8682329 Method of performing handover between heterogeneous networks and user equipment apparatus for the same Jonghoon Lee, Hongku Ahn 2014-03-25
8421201 Integrated circuit packaging system with underfill and methods of manufacture thereof KyungHoon Lee, DaeWook Yang 2013-04-16
8264059 Semiconductor device and method of forming holes in substrate to interconnect top shield and ground shield OhHan Kim, KyungHoon Lee 2012-09-11
8137995 Double-sided semiconductor device and method of forming top-side and bottom-side interconnect structures OhHan Kim, JoungUn Park 2012-03-20
7906371 Semiconductor device and method of forming holes in substrate to interconnect top shield and ground shield OhHan Kim, KyungHoon Lee 2011-03-15
7229495 Silicon wafer and method for producing silicon single crystal Hyon-Jong Cho, Cheol Woo LEE, Hong-Woo Lee, Jin Soo Cheong 2007-06-12