Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12202797 | Method for producing pyrrole compound | Takashi Ouchi, Giho Goh, Jinsoon Choi, Hunsoo Park | 2025-01-21 |
| 11897005 | Nozzle, substrate processing apparatus including the same, and substrate processing method | Oh Jin Kwon, Sehyeong Choi | 2024-02-13 |
| 11649206 | Method for producing pyrrole compound | Takashi Ouchi, Giho Goh, Jinsoon Choi, Hunsoo Park | 2023-05-16 |
| 11529655 | Nozzle, substrate processing apparatus including the same, and substrate processing method | Oh Jin Kwon, Sehyeong Choi | 2022-12-20 |
| 11066362 | Method for producing pyrrole compound | Takashi Ouchi, Giho Goh, Jinsoon Choi, Hunsoo Park | 2021-07-20 |
| 10979645 | Video capturing device including cameras and video capturing system including the same | Daesang Kim | 2021-04-13 |
| 10570091 | Method for producing pyrrole compound | Takashi Ouchi, Giho Goh, Jinsoon Choi, Hunsoo Park | 2020-02-25 |
| 9574295 | Washing machine and method of controlling same | Dowan KIM, Youngkee Oh | 2017-02-21 |
| 9543258 | Semiconductor device and method of forming holes in substrate to interconnect top shield and ground shield | OhHan Kim, KyungHoon Lee | 2017-01-10 |
| 9293349 | Semiconductor device and method of forming holes in substrate to interconnect top shield and ground shield | OhHan Kim, KyungHoon Lee | 2016-03-22 |
| 9053953 | Integrated circuit packaging system with underfill and method of manufacture thereof | KyungHoon Lee, DaeWook Yang | 2015-06-09 |
| 8682329 | Method of performing handover between heterogeneous networks and user equipment apparatus for the same | Jonghoon Lee, Hongku Ahn | 2014-03-25 |
| 8421201 | Integrated circuit packaging system with underfill and methods of manufacture thereof | KyungHoon Lee, DaeWook Yang | 2013-04-16 |
| 8264059 | Semiconductor device and method of forming holes in substrate to interconnect top shield and ground shield | OhHan Kim, KyungHoon Lee | 2012-09-11 |
| 8137995 | Double-sided semiconductor device and method of forming top-side and bottom-side interconnect structures | OhHan Kim, JoungUn Park | 2012-03-20 |
| 7906371 | Semiconductor device and method of forming holes in substrate to interconnect top shield and ground shield | OhHan Kim, KyungHoon Lee | 2011-03-15 |
| 7229495 | Silicon wafer and method for producing silicon single crystal | Hyon-Jong Cho, Cheol Woo LEE, Hong-Woo Lee, Jin Soo Cheong | 2007-06-12 |