Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor device and method of forming holes in substrate to interconnect top shield and ground shield

Semiconductor device and method of forming holes in substrate to interconnect top shield and ground shield

US Patent 9293349 · Granted Mar 22, 2016

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method for controlling boat/strip type solder ball placement system2025
Cooling device and process for cooling double-sided SiP devices during sputterin2025
Automatically executing application routines with user inputs2025
Method for producing pyrrole compound2025
Display device comprising a substrate having a first subpixel and a second subpi2025
Intelligent power generation module2024
Intelligent power generation module2024
Cooling device and process for cooling double-sided SiP devices during sputterin2024
Electronic device for operating a cellular communication and method for the same2024
Display device having an oxide insulating film between subpixels and method for 2024
Nozzle, substrate processing apparatus including the same, and substrate process2024
Electronic device and method for processing call request in electronic device2024