Jungbae Lee — 15 Patents at Micron

Jungbae Lee has been granted 15 US patents while listed as an inventor at Micron. The first was granted in 2020 and the most recent in June 2025. Jungbae Lee ranks #307,048 of 4,157,543 US inventors in our database (top 7.4%). Patent records list Jungbae Lee in Taichung, ID, TW.

Issued Patents All Time

Showing 1–15 of 15 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
12341128	Stacked semiconductor dies for semiconductor device assemblies	—	2025-06-24
11942455	Stacked semiconductor dies for semiconductor device assemblies	Yeongbeom Ko, Youngik Kwon, Jong Sik Paek	2024-03-26	$24,732,000
11923332	Semiconductor die with capillary flow structures for direct chip attachment	—	2024-03-05	$17,899,000
11887938	Semiconductor device assemblies with conductive underfill dams for grounding EMI shields and methods for making the same	—	2024-01-30	$12,191,000
11810894	Solderless interconnect for semiconductor device assembly	—	2023-11-07	$14,606,000
11688706	Semiconductor device assembly with embossed solder mask having non-planar features and associated methods and systems	—	2023-06-27	$8,383,000
11682563	Semiconductor device assembly with graded modulus underfill and associated methods and systems	Chih-Hong Wang	2023-06-20	$16,908,000
11621245	Microelectronic device packages with EMI shielding, methods of fabricating and related electronic systems	Yeongbeom Ko, Youngik Kwon	2023-04-04	$16,794,000
11532595	Stacked semiconductor dies for semiconductor device assemblies	—	2022-12-20	$19,538,000
11404289	Semiconductor device assembly with graded modulus underfill and associated methods and systems	Chih-Hong Wang	2022-08-02	$10,849,000
11362071	Stacked semiconductor dies for semiconductor device assemblies	Yeongbeom Ko, Youngik Kwon, Jong Sik Paek	2022-06-14	$13,168,000
11342277	Semiconductor device assemblies with conductive underfill dams for grounding EMI shields and methods for making the same	—	2022-05-24	$16,890,000
11264349	Semiconductor die with capillary flow structures for direct chip attachment	—	2022-03-01	$21,169,000
11094668	Solderless interconnect for semiconductor device assembly	—	2021-08-17	$19,603,000
10559550	Memory device including heterogeneous volatile memory chips and electronic device including the same	Kwanghyun Kim, Sang-Kyu Kang, Do Kyun Kim, Dongmin Kim, Ji-Hyun Ahn	2020-02-11

Jungbae Lee — 15 Patents

Issued Patents All Time

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