Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12341128 | Stacked semiconductor dies for semiconductor device assemblies | — | 2025-06-24 |
| 11942455 | Stacked semiconductor dies for semiconductor device assemblies | Yeongbeom Ko, Youngik Kwon, Jong Sik Paek | 2024-03-26 |
| 11923332 | Semiconductor die with capillary flow structures for direct chip attachment | — | 2024-03-05 |
| 11887938 | Semiconductor device assemblies with conductive underfill dams for grounding EMI shields and methods for making the same | — | 2024-01-30 |
| 11810894 | Solderless interconnect for semiconductor device assembly | — | 2023-11-07 |
| 11688706 | Semiconductor device assembly with embossed solder mask having non-planar features and associated methods and systems | — | 2023-06-27 |
| 11682563 | Semiconductor device assembly with graded modulus underfill and associated methods and systems | Chih-Hong Wang | 2023-06-20 |
| 11621245 | Microelectronic device packages with EMI shielding, methods of fabricating and related electronic systems | Yeongbeom Ko, Youngik Kwon | 2023-04-04 |
| 11532595 | Stacked semiconductor dies for semiconductor device assemblies | — | 2022-12-20 |
| 11404289 | Semiconductor device assembly with graded modulus underfill and associated methods and systems | Chih-Hong Wang | 2022-08-02 |
| 11362071 | Stacked semiconductor dies for semiconductor device assemblies | Yeongbeom Ko, Youngik Kwon, Jong Sik Paek | 2022-06-14 |
| 11342277 | Semiconductor device assemblies with conductive underfill dams for grounding EMI shields and methods for making the same | — | 2022-05-24 |
| 11264349 | Semiconductor die with capillary flow structures for direct chip attachment | — | 2022-03-01 |
| 11094668 | Solderless interconnect for semiconductor device assembly | — | 2021-08-17 |
| 10559550 | Memory device including heterogeneous volatile memory chips and electronic device including the same | Kwanghyun Kim, Sang-Kyu Kang, Do Kyun Kim, Dongmin Kim, Ji-Hyun Ahn | 2020-02-11 |