Issued Patents All Time
Showing 51–75 of 80 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9418922 | Semiconductor device with reduced thickness | Doo Hyun Park | 2016-08-16 |
| 9406638 | Semiconductor device and manufacturing method thereof | Doo Hyun Park | 2016-08-02 |
| 9391043 | Semiconductor device and manufacturing method thereof | Won Chul Do, Doo Hyun Park, Eun Ho Park, Sung Jae Oh | 2016-07-12 |
| 9219042 | Semiconductor device and manufacturing method thereof | Doo Hyun Park | 2015-12-22 |
| 9196601 | Semiconductor device | Doo Hyun Park, Seong Min Seo, Seok Woo Yun, Ji Hun Lee, Seo Yeon Ahn +1 more | 2015-11-24 |
| 9190370 | Semiconductor device utilizing redistribution layers to couple stacked die | Doo Hyun Park, Won Chul Do, Pil Je Sung, Jin-Hee Park, Do Hyung Kim +4 more | 2015-11-17 |
| 9123543 | Semiconductor device and manufacturing method thereof | Jung Gi Jin, Sung Su Park, Seok KIM, Tae Kyung Hwang, Se Woong Cha | 2015-09-01 |
| 9048241 | Semiconductor device utilzing redistribution layers to couple stacked die | Doo Hyun Park, Seong Min Seo, Won Chul Do, Pil Je Sung, Jin-Hee Park +5 more | 2015-06-02 |
| 9048125 | Semiconductor device and manufacturing method thereof | Won Chul Do, Doo Hyun Park, Eun Ho Park, Sung Jae Oh | 2015-06-02 |
| 9000586 | Semiconductor device and manufacturing method thereof | Won Chul Do, Doo Hyun Park, Ji Hun Lee, Seong Min Seo | 2015-04-07 |
| 8618658 | Semiconductor device and fabricating method thereof | Won Chul Do, Eun Sook Sohn | 2013-12-31 |
| 8446017 | Stackable wafer level package and fabricating method thereof | In Bae Park, Chang Deok Lee | 2013-05-21 |
| 8362612 | Semiconductor device and manufacturing method thereof | Eun Sook Sohn, In Bae Park, Won Chul Do, Glenn Rinne | 2013-01-29 |
| 8058726 | Semiconductor device having redistribution layer | Jung Gi Jin, Sung Su Park, Seok KIM, Tae Kyung Hwang, Se Woong Cha | 2011-11-15 |
| 7808105 | Semiconductor package and fabricating method thereof | — | 2010-10-05 |
| 7446422 | Wafer level chip scale package and manufacturing method for the same | Sung Su Park, Seong Min Seo | 2008-11-04 |
| 7359579 | Image sensor package and its manufacturing method | Ho-cheol Jang, Seong Min Seo | 2008-04-15 |
| 7335986 | Wafer level chip scale package | Sung Su Park, Ho-cheol Jang, Jung Gi Jin | 2008-02-26 |
| 7045882 | Semiconductor package including flip chip | — | 2006-05-16 |
| 7045893 | Semiconductor package and method for manufacturing the same | Kwang Eung Lee, Seung Ju Lee | 2006-05-16 |
| 6987319 | Wafer-level chip-scale package | In Bae Park, Seong Min Seo | 2006-01-17 |
| 6953988 | Semiconductor package | Seong Min Seo, Young Suk Chung, Jae Hun Ku, Jae Hak Yee | 2005-10-11 |
| 6927478 | Reduced size semiconductor package with stacked dies | — | 2005-08-09 |
| 6858919 | Semiconductor package | Seong Min Seo, Young Suk Chung, Jae Hun Ku, Jae Hak Yee | 2005-02-22 |
| 6846704 | Semiconductor package and method for manufacturing the same | — | 2005-01-25 |