Issued Patents All Time
Showing 76–80 of 80 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6841874 | Wafer-level chip-scale package | In Bae Park, Seong Min Seo | 2005-01-11 |
| 6803645 | Semiconductor package including flip chip | — | 2004-10-12 |
| 6759737 | Semiconductor package including stacked chips with aligned input/output pads | Seong Min Seo, Young Suk Chung, Jae Hun Ku, Jae Hak Yee | 2004-07-06 |
| 6740950 | Optical device packages having improved conductor efficiency, optical coupling and thermal transfer | — | 2004-05-25 |
| 6700187 | Semiconductor package and method for manufacturing the same | — | 2004-03-02 |