Issued Patents All Time
Showing 26–50 of 80 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515825 | Semiconductor device and manufacturing method thereof | Doo Hyun Park, Seong Min Seo, Sung Geun Kang, Yong Seon Song, Wang Gu Lee +3 more | 2019-12-24 |
| 10483222 | Semiconductor device and manufacturing method thereof | Eun Sook Sohn, In Bae Park, Won Chul Do, Glenn Rinne | 2019-11-19 |
| 10297466 | Semiconductor device and manufacturing method thereof | Won Chul Do, Doo Hyun Park, Ji Hun Lee, Seong Min Seo | 2019-05-21 |
| 10199322 | Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers | Jin Young Kim, YoonJoo Kim, Jin Han Kim, Seungjae Lee, Se Woong Cha +4 more | 2019-02-05 |
| 10163855 | Semiconductor device and manufacturing method thereof | Doo Hyun Park | 2018-12-25 |
| 10128176 | Semiconductor device and manufacturing method thereof | William Huang, Raymond Tsao, Mike Liang | 2018-11-13 |
| 10090185 | Semiconductor device and manufacturing method thereof | Doo Hyun Park | 2018-10-02 |
| 10079157 | Semiconductor device and manufacturing method thereof | Doo Hyun Park, Seong Min Seo, Sung Geun Kang, Yong Seon Song, Wang Gu Lee +3 more | 2018-09-18 |
| 10032740 | Semiconductor device and manufacturing method thereof | Doo Hyun Park | 2018-07-24 |
| 9966276 | Semiconductor device and manufacturing method thereof | Won Chul Do, Doo Hyun Park, Ji Hun Lee, Seong Min Seo | 2018-05-08 |
| 9929113 | Semiconductor package and manufacturing method thereof | No Sun Park | 2018-03-27 |
| 9871011 | Semiconductor package using a contact in a pleated sidewall encapsulant opening | Jae Yun Kim, Tae Kyung Hwang, Jin Han Kim, Kyoung Rock Kim, Byong Jin Kim +1 more | 2018-01-16 |
| 9818685 | Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers | Jin Young Kim, YoonJoo Kim, Jin Han Kim, Seungjae Lee, Se Woong Cha +4 more | 2017-11-14 |
| 9818721 | Semiconductor device and manufacturing method thereof | Doo Hyun Park | 2017-11-14 |
| 9793180 | Semiconductor device and manufacturing method thereof | Seo Yeon Ahn, Doo Hyun Park, Pil Je Sung, Won Chul Do, Young Rae Kim +2 more | 2017-10-17 |
| 9748154 | Wafer level fan out semiconductor device and manufacturing method thereof | Boo Yang Jung, Choon Heung Lee, In Bae Park, Sang Won Kim, Sung Kyu Kim +1 more | 2017-08-29 |
| 9728514 | Semiconductor device and manufacturing method thereof | Won Chul Do, Doo Hyun Park, Eun Ho Park, Sung Jae Oh | 2017-08-08 |
| 9711484 | Semiconductor package with semiconductor die directly attached to lead frame and method | Doo Hyun Park, Wang Gu Lee, Yong Seon Song, Sung Geun Kang | 2017-07-18 |
| 9536858 | Semiconductor device and manufacturing method thereof | Won Chul Do, Doo Hyun Park, Ji Hun Lee, Seong Min Seo | 2017-01-03 |
| 9524906 | Semiconductor device and manufacturing method thereof | Eun Sook Sohn, In Bae Park, Won Chul Do, Glenn Rinne | 2016-12-20 |
| 9502375 | Semiconductor device with plated pillars and leads | Doo Hyun Park, Seong Min Seo | 2016-11-22 |
| 9484331 | Semiconductor device and manufacturing method thereof | Doo Hyun Park | 2016-11-01 |
| 9478517 | Electronic device package structure and method of fabricating the same | Doo Hyun Park, Yoon Joo Kim, Seong Min Seo, Young Suk Chung | 2016-10-25 |
| 9466580 | Semiconductor package and manufacturing method thereof | No Sun Park | 2016-10-11 |
| 9449946 | Semiconductor device and manufacturing method thereof | Pil Je Sung, Seong Min Seo, Seo Yeon Ahn, Hui Tae Kim | 2016-09-20 |