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Package-on-package type semiconductor package |
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Electronic device package and fabricating method thereof |
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Wafer-level stack chip package and method of manufacturing the same |
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Electronic device package and fabricating method thereof |
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Method of manufacturing a package-on-package type semiconductor package |
Dong Jin Kim, Jin Han Kim, Ji Hun Lee, Joon Dong Kim, Yeong Beom Ko |
2022-11-22 |
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Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers |
Jong Sik Paek, Jin Young Kim, YoonJoo Kim, Jin Han Kim, Seungjae Lee +4 more |
2022-08-23 |
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Electronic device package and fabricating method thereof |
Jin Young Kim, No Sun Park, Yoon Joo Kim, Seung Jae Lee, Sung Kyu Kim +1 more |
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Method of manufacturing a package-on-package type semiconductor package |
Dong Jin Kim, Jin Han Kim, Ji Hun Lee, Joon Dong Kim, Yeong Beom Ko |
2020-12-15 |
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Wafer-level stack chip package and method of manufacturing the same |
Yeong Beom Ko, Dong Jin Kim |
2020-09-22 |
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Electronic device package and fabricating method thereof |
Jin Young Kim, No Sun Park, Yoon Joo Kim, Seung Jae Lee, Sung Kyu Kim +1 more |
2020-06-23 |
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Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers |
Jong Sik Paek, Jin Young Kim, YoonJoo Kim, Jin Han Kim, Seungjae Lee +4 more |
2020-06-02 |
| 10304890 |
Electronic device package and fabricating method thereof |
Jin Young Kim, No Sun Park, Yoon Joo Kim, Seung Jae Lee, Sung Kyu Kim +1 more |
2019-05-28 |
| 10290621 |
Method of manufacturing a package-on-package type semiconductor package |
Dong Jin Kim, Jin Han Kim, Ji Hun Lee, Joon Dong Kim, Yeong Beom Ko |
2019-05-14 |
| 10199322 |
Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers |
Jong Sik Paek, Jin Young Kim, YoonJoo Kim, Jin Han Kim, Seungjae Lee +4 more |
2019-02-05 |
| 10115705 |
Semiconductor package and manufacturing method thereof |
Jin Young Kim, No Sun Park, Yoon Joo Kim, Choon Heung Lee, Jin Han Kim +3 more |
2018-10-30 |
| 9831282 |
Electronic device package and fabricating method thereof |
Jin Young Kim, No Sun Park, Yoon Joo Kim, Seung Jae Lee, Sung Kyu Kim +1 more |
2017-11-28 |
| 9818685 |
Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers |
Jong Sik Paek, Jin Young Kim, YoonJoo Kim, Jin Han Kim, Seungjae Lee +4 more |
2017-11-14 |
| 9741701 |
Method of manufacturing a package-on-package type semiconductor package |
Dong Jin Kim, Jin Han Kim, Ji Hun Lee, Joon Dong Kim, Yeong Beom Ko |
2017-08-22 |
| 9431447 |
Package of finger print sensor and fabricating method thereof |
Jin Young Kim, No Sun Park, Yoon Joo Kim, Seung Jae Lee, Sung Kyu Kim +1 more |
2016-08-30 |
| 9406639 |
Semiconductor package and manufacturing method thereof |
Jin Young Kim, No Sun Park, Yoon Joo Kim, Choon Heung Lee, Jin Han Kim +3 more |
2016-08-02 |
| 9129873 |
Package of finger print sensor and fabricating method thereof |
Jin Young Kim, No Sun Park, Yoon Joo Kim, Seung Jae Lee, Sung Kyu Kim +1 more |
2015-09-08 |
| 9123543 |
Semiconductor device and manufacturing method thereof |
Jung Gi Jin, Jong Sik Paek, Sung Su Park, Seok KIM, Tae Kyung Hwang |
2015-09-01 |
| 8946883 |
Wafer level fan-out package with a fiducial die |
Sung Kyu Kim, Jin Young Kim, Yoon Joo Kim, Jin Han Kim, Seung Jae Lee +3 more |
2015-02-03 |
| 8058726 |
Semiconductor device having redistribution layer |
Jung Gi Jin, Jong Sik Paek, Sung Su Park, Seok KIM, Tae Kyung Hwang |
2011-11-15 |
| 7982316 |
Semiconductor package having a land to absorb thermal and mechanical stress and fabricating method thereof |
Min-Woo Lee, Jae Hyun SHIN |
2011-07-19 |