Issued Patents All Time
Showing 1–25 of 25 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12255197 | Package-on-package type semiconductor package | Dong Jin Kim, Jin Han Kim, Ji Hun Lee, Joon Dong Kim, Yeong Beom Ko | 2025-03-18 |
| 12230661 | Electronic device package and fabricating method thereof | Jin Young Kim, No Sun Park, Yoon Joo Kim, Seung Jae Lee, Sung Kyu Kim +1 more | 2025-02-18 |
| 12033910 | Wafer-level stack chip package and method of manufacturing the same | Yeong Beom Ko, Dong Jin Kim | 2024-07-09 |
| 11961867 | Electronic device package and fabricating method thereof | Jin Young Kim, No Sun Park, Yoon Joo Kim, Seung Jae Lee, Sung Kyu Kim +1 more | 2024-04-16 |
| 11508712 | Method of manufacturing a package-on-package type semiconductor package | Dong Jin Kim, Jin Han Kim, Ji Hun Lee, Joon Dong Kim, Yeong Beom Ko | 2022-11-22 |
| 11424180 | Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers | Jong Sik Paek, Jin Young Kim, YoonJoo Kim, Jin Han Kim, Seungjae Lee +4 more | 2022-08-23 |
| 11362128 | Electronic device package and fabricating method thereof | Jin Young Kim, No Sun Park, Yoon Joo Kim, Seung Jae Lee, Sung Kyu Kim +1 more | 2022-06-14 |
| 10867984 | Method of manufacturing a package-on-package type semiconductor package | Dong Jin Kim, Jin Han Kim, Ji Hun Lee, Joon Dong Kim, Yeong Beom Ko | 2020-12-15 |
| 10784178 | Wafer-level stack chip package and method of manufacturing the same | Yeong Beom Ko, Dong Jin Kim | 2020-09-22 |
| 10692918 | Electronic device package and fabricating method thereof | Jin Young Kim, No Sun Park, Yoon Joo Kim, Seung Jae Lee, Sung Kyu Kim +1 more | 2020-06-23 |
| 10672699 | Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers | Jong Sik Paek, Jin Young Kim, YoonJoo Kim, Jin Han Kim, Seungjae Lee +4 more | 2020-06-02 |
| 10304890 | Electronic device package and fabricating method thereof | Jin Young Kim, No Sun Park, Yoon Joo Kim, Seung Jae Lee, Sung Kyu Kim +1 more | 2019-05-28 |
| 10290621 | Method of manufacturing a package-on-package type semiconductor package | Dong Jin Kim, Jin Han Kim, Ji Hun Lee, Joon Dong Kim, Yeong Beom Ko | 2019-05-14 |
| 10199322 | Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers | Jong Sik Paek, Jin Young Kim, YoonJoo Kim, Jin Han Kim, Seungjae Lee +4 more | 2019-02-05 |
| 10115705 | Semiconductor package and manufacturing method thereof | Jin Young Kim, No Sun Park, Yoon Joo Kim, Choon Heung Lee, Jin Han Kim +3 more | 2018-10-30 |
| 9831282 | Electronic device package and fabricating method thereof | Jin Young Kim, No Sun Park, Yoon Joo Kim, Seung Jae Lee, Sung Kyu Kim +1 more | 2017-11-28 |
| 9818685 | Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers | Jong Sik Paek, Jin Young Kim, YoonJoo Kim, Jin Han Kim, Seungjae Lee +4 more | 2017-11-14 |
| 9741701 | Method of manufacturing a package-on-package type semiconductor package | Dong Jin Kim, Jin Han Kim, Ji Hun Lee, Joon Dong Kim, Yeong Beom Ko | 2017-08-22 |
| 9431447 | Package of finger print sensor and fabricating method thereof | Jin Young Kim, No Sun Park, Yoon Joo Kim, Seung Jae Lee, Sung Kyu Kim +1 more | 2016-08-30 |
| 9406639 | Semiconductor package and manufacturing method thereof | Jin Young Kim, No Sun Park, Yoon Joo Kim, Choon Heung Lee, Jin Han Kim +3 more | 2016-08-02 |
| 9129873 | Package of finger print sensor and fabricating method thereof | Jin Young Kim, No Sun Park, Yoon Joo Kim, Seung Jae Lee, Sung Kyu Kim +1 more | 2015-09-08 |
| 9123543 | Semiconductor device and manufacturing method thereof | Jung Gi Jin, Jong Sik Paek, Sung Su Park, Seok KIM, Tae Kyung Hwang | 2015-09-01 |
| 8946883 | Wafer level fan-out package with a fiducial die | Sung Kyu Kim, Jin Young Kim, Yoon Joo Kim, Jin Han Kim, Seung Jae Lee +3 more | 2015-02-03 |
| 8058726 | Semiconductor device having redistribution layer | Jung Gi Jin, Jong Sik Paek, Sung Su Park, Seok KIM, Tae Kyung Hwang | 2011-11-15 |
| 7982316 | Semiconductor package having a land to absorb thermal and mechanical stress and fabricating method thereof | Min-Woo Lee, Jae Hyun SHIN | 2011-07-19 |