Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12334450 | Semiconductor devices and methods of manufacturing semiconductor devices | Jin Seong Kim, Kwang Seok Oh, Jo Hyun Bae, Sung Woo Lim, Yun Ah Kim +2 more | 2025-06-17 |
| 12327812 | Semiconductor device and manufacturing method thereof | Jin Han Kim, Dong Jin Kim, Do Hyung Kim, Glenn Rinne | 2025-06-10 |
| 12255197 | Package-on-package type semiconductor package | Dong Jin Kim, Jin Han Kim, Se Woong Cha, Ji Hun Lee, Joon Dong Kim | 2025-03-18 |
| 12033910 | Wafer-level stack chip package and method of manufacturing the same | Dong Jin Kim, Se Woong Cha | 2024-07-09 |
| 11901332 | Semiconductor device and manufacturing method thereof | Jin Han Kim, Dong Jin Kim, Do Hyung Kim, Glenn Rinne | 2024-02-13 |
| 11854991 | Semiconductor devices and methods of manufacturing semiconductor devices | Jin Seong Kim, Kwang Seok Oh, Jo Hyun Bae, Sung Woo Lim, Yun Ah Kim +2 more | 2023-12-26 |
| 11715714 | Semiconductor devices and methods of manufacturing semiconductor devices | Jo Hyun Bae, Sung Woo Lim, Yun Ah Kim | 2023-08-01 |
| 11508712 | Method of manufacturing a package-on-package type semiconductor package | Dong Jin Kim, Jin Han Kim, Se Woong Cha, Ji Hun Lee, Joon Dong Kim | 2022-11-22 |
| 11158582 | Semiconductor devices and methods of manufacturing semiconductor devices | Jin Seong Kim, Kwang Seok Oh, Jo Hyun Bae, Sung Woo Lim, Yun Ah Kim +2 more | 2021-10-26 |
| 11121105 | Semiconductor devices and methods of manufacturing semiconductor devices | Jo Hyun Bae, Sung Woo Lim, Yun Ah Kim | 2021-09-14 |
| 11094645 | Semiconductor device and method of manufacturing a semiconductor device | Hee Sung Kim, Joon Dong Kim, Dong Jean Kim, Sang Seon Oh | 2021-08-17 |
| 11031370 | Semiconductor device and manufacturing method thereof | Jin Han Kim, Dong Jin Kim, Do Hyung Kim, Glenn Rinne | 2021-06-08 |
| 10867984 | Method of manufacturing a package-on-package type semiconductor package | Dong Jin Kim, Jin Han Kim, Se Woong Cha, Ji Hun Lee, Joon Dong Kim | 2020-12-15 |
| 10784178 | Wafer-level stack chip package and method of manufacturing the same | Dong Jin Kim, Se Woong Cha | 2020-09-22 |
| 10410993 | Manufacturing method of semiconductor device and semiconductor device thereof | Jin Han Kim, Dong Jin Kim, Do Hyung Kim, Glenn Rinne | 2019-09-10 |
| 10381313 | Semiconductor device and method of manufacturing a semiconductor device | Hee Sung Kim, Joon Dong Kim, Dong Jean Kim, Sang Seon Oh | 2019-08-13 |
| 10290621 | Method of manufacturing a package-on-package type semiconductor package | Dong Jin Kim, Jin Han Kim, Se Woong Cha, Ji Hun Lee, Joon Dong Kim | 2019-05-14 |
| 10134687 | Semiconductor device and method of manufacturing a semiconductor device | Hee Sung Kim, Joon Dong Kim, Dong Jean Kim, Sang Seon Oh | 2018-11-20 |
| 10056349 | Manufacturing method of semiconductor device and semiconductor device thereof | Jin Han Kim, Dong Jin Kim, Do Hyung Kim, Glenn Rinne | 2018-08-21 |
| 9837376 | Manufacturing method of semiconductor device and semiconductor device thereof | Jin Han Kim, Dong Jin Kim, Do Hyung Kim, Glenn Rinne | 2017-12-05 |
| 9741701 | Method of manufacturing a package-on-package type semiconductor package | Dong Jin Kim, Jin Han Kim, Se Woong Cha, Ji Hun Lee, Joon Dong Kim | 2017-08-22 |
| 9490231 | Manufacturing method of semiconductor device and semiconductor device thereof | Jin Han Kim, Dong Jin Kim, Do Hyung Kim, Glenn Rinne | 2016-11-08 |