| 10128176 |
Semiconductor device and manufacturing method thereof |
Jong Sik Paek, William Huang, Raymond Tsao |
2018-11-13 |
| 6674166 |
Flip-chip integrated circuit routing to I/O devices |
Ramoji Karumuri Rao |
2004-01-06 |
| 6591410 |
Six-to-one signal/power ratio bump and trace pattern for flip chip design |
Anwar Ali, Bing-Wei Yi |
2003-07-08 |
| 6526540 |
Flip chip trace library generator |
Eric Fong, Thinh Tran |
2003-02-25 |
| 6480989 |
Integrated circuit design incorporating a power mesh |
Chun Chan, Tammy Huang |
2002-11-12 |
| 6457157 |
I/O device layout during integrated circuit design |
Virinder Singh |
2002-09-24 |
| 6323559 |
Hexagonal arrangements of bump pads in flip-chip integrated circuits |
Chun Chan |
2001-11-27 |
| 6243849 |
Method and apparatus for netlist filtering and cell placement |
Virinder Singh |
2001-06-05 |
| 6225143 |
Flip-chip integrated circuit routing to I/O devices |
Ramoji Karumuri Rao |
2001-05-01 |
| 6118180 |
Semiconductor die metal layout for flip chip packaging |
Mike C. Loo, Ramoji Karumuri Rao |
2000-09-12 |
| 6057169 |
Method for I/O device layout during integrated circuit design |
Virinder Singh |
2000-05-02 |
| 5952726 |
Flip chip bump distribution on die |
— |
1999-09-14 |
| 5885855 |
Method for distributing connection pads on a semiconductor die |
— |
1999-03-23 |
| 5808900 |
Memory having direct strap connection to power supply |
Myron Buer, Kevin LeClair, Sudhakar Sabada |
1998-09-15 |
