Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10360341 | Integrated metal layer aware optimization of integrated circuit designs | Abhijeet Chakraborty, David John Seibert, Pingkan Fok | 2019-07-23 |
| 6674166 | Flip-chip integrated circuit routing to I/O devices | Mike Liang | 2004-01-06 |
| 6225143 | Flip-chip integrated circuit routing to I/O devices | Mike Liang | 2001-05-01 |
| 6118180 | Semiconductor die metal layout for flip chip packaging | Mike C. Loo, Mike Liang | 2000-09-12 |