Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 6191483 | Package structure for low cost and ultra thin chip scale package | — | 2001-02-20 | |
| 6118180 | Semiconductor die metal layout for flip chip packaging | Mike Liang, Ramoji Karumuri Rao | 2000-09-12 | $14,671,000 |
| 5784780 | Method of mounting a flip-chip | — | 1998-07-28 | $5,053,000 |
| 5648890 | Upgradable multi-chip module | Alfred S. Conte | 1997-07-15 | $25,301,000 |
| 5648893 | Upgradable multi-chip module | Alfred S. Conte | 1997-07-15 | $25,301,000 |
| 5637920 | High contact density ball grid array package for flip-chips | — | 1997-06-10 | $8,723,000 |
| 5394009 | Tab semiconductor package with cushioned land grid array outer lead bumps | — | 1995-02-28 | $10,234,000 |
| 5380956 | Multi-chip cooling module and method | Marlin R. Vogel | 1995-01-10 | $18,404,000 |