Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11203181 | Barrier film-containing format and the use thereof for pre-applied underfill film for 3D TSV packages | Jie Bai, Hung The Chau, Tadashi Takano | 2021-12-21 |
| 10242923 | Formulations containing mixed resin systems and the use thereof for wafer-level underfill for 3D TSV packages | Jie Bai, Qiaohong Huang, Hong Jiang, Youko Murata, YounSang Kim +1 more | 2019-03-26 |
| 9771500 | Sealant composition for electronic device | Kenichiro Sato, Mieko Sano | 2017-09-26 |
| 9576871 | Composition for electronic device | Kenichiro Sato, Mieko Sano | 2017-02-21 |
| 9436085 | Composition for forming photosensitive resist underlayer film | Makiko Umezaki, Noriaki Fujitani, Hirokazu Nishimaki, Takahiro Kishioka, Takahiro Hamada | 2016-09-06 |
| 9334429 | Underfill sealant composition | Mieko Sano, Kenichiro Sato | 2016-05-10 |
| 8481247 | Resist underlayer film forming composition containing liquid additive | Tetsuya Shinjo, Satoshi Takei | 2013-07-09 |
| 8227172 | Method of producing semiconductor device using resist underlayer film by photo-crosslinking curing | Satoshi Takei, Tetsuya Shinjo | 2012-07-24 |
| 8048615 | Silicon-containing resist underlayer coating forming composition for forming photo-crosslinking cured resist underlayer coating | Satoshi Takei, Keisuke Hashimoto, Makoto Nakajima | 2011-11-01 |